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TSV912IST

TSV912IST

Manufacturer No:

TSV912IST

Manufacturer:

STMicroelectronics

Description:

IC OPAMP GP 2 CIRCUIT 8MINISO

Datasheet:

Datasheet

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TSV912IST Specifications

  • Type
    Parameter
  • -3db Bandwidth
    -
  • Gain Bandwidth Product
    8 MHz
  • Supplier Device Package
    8-MiniSO
  • Package / Case
    8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Voltage - Supply Span (Max)
    5.5 V
  • Voltage - Supply Span (Min)
    2.5 V
  • Current - Output / Channel
    35 mA
  • Current - Supply
    780µA (x2 Channels)
  • Voltage - Input Offset
    100 µV
  • Current - Input Bias
    1 pA
  • Slew Rate
    4.5V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    2
  • Amplifier Type
    General Purpose
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The TSV912IST is a specific model of integrated circuit (IC) chip manufactured by STMicroelectronics. It is a low-power, high-speed operational amplifier (op-amp) designed for various applications. Here are some advantages and application scenarios of the TSV912IST IC chip:Advantages: 1. Low power consumption: The TSV912IST is designed to operate at low power levels, making it suitable for battery-powered devices and energy-efficient applications. 2. High-speed operation: It offers a high slew rate and fast settling time, enabling it to handle high-frequency signals accurately. 3. Rail-to-rail input and output: The chip supports rail-to-rail input and output voltage ranges, allowing it to handle signals close to the power supply rails, maximizing dynamic range and signal fidelity. 4. Low input and output voltage offset: It has a low input and output voltage offset, ensuring accurate amplification and minimizing errors in signal processing.Application scenarios: 1. Portable devices: The low power consumption and rail-to-rail capabilities make the TSV912IST suitable for portable devices like smartphones, tablets, and wearable electronics, where power efficiency and signal integrity are crucial. 2. Sensor interfaces: The chip's high-speed operation and low offset voltage make it suitable for amplifying and conditioning signals from various sensors, such as temperature sensors, pressure sensors, and light sensors. 3. Audio amplification: The TSV912IST can be used in audio amplification circuits, such as headphone amplifiers, audio mixers, and preamplifiers, where low distortion and high fidelity are desired. 4. Signal conditioning: It can be used in signal conditioning circuits for data acquisition systems, instrumentation, and industrial control applications, where accurate amplification and filtering of signals are required. 5. Communication systems: The high-speed operation and low power consumption make the TSV912IST suitable for communication systems, including wireless transceivers, base stations, and data communication equipment.It's important to note that the specific application scenarios may vary depending on the requirements and specifications of the overall system design.
TSV912IST Relevant information