LMV301SQ3T2G

LMV301SQ3T2G

Manufacturer No:

LMV301SQ3T2G

Description:

LMV301S - OP AMP CMOS 1MHZ SOT-3

Datasheet:

Datasheet

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LMV301SQ3T2G Specifications

  • Type
    Parameter
  • -3db Bandwidth
    -
  • Supplier Device Package
    SC-88A (SC-70-5/SOT-353)
  • Package / Case
    5-TSSOP, SC-70-5, SOT-353
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TJ)
  • Voltage - Supply Span (Max)
    5 V
  • Voltage - Supply Span (Min)
    1.8 V
  • Current - Output / Channel
    160 mA
  • Current - Supply
    -
  • Voltage - Input Offset
    1.7 mV
  • Current - Input Bias
    3 pA
  • Gain Bandwidth Product
    1 MHz
  • Slew Rate
    1V/µs
  • Output Type
    Single Ended, Rail-to-Rail
  • Number of Circuits
    1
  • Amplifier Type
    Standard
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The LMV301SQ3T2G is a low-power, low-voltage operational amplifier integrated circuit chip. Some of its advantages and application scenarios include:1. Low Power Consumption: The LMV301SQ3T2G is designed to operate at low power levels, making it suitable for battery-powered applications or any application where power efficiency is crucial.2. Low Voltage Operation: This chip can operate at low supply voltages, typically ranging from 1.8V to 5.5V. This makes it suitable for applications where low voltage operation is required, such as portable devices or low-power sensor circuits.3. Rail-to-Rail Input and Output: The LMV301SQ3T2G supports rail-to-rail input and output voltage ranges. This means that it can handle input signals that are close to the supply voltage rails, allowing for maximum utilization of the available voltage range.4. Wide Bandwidth: With a bandwidth of up to 1 MHz, the LMV301SQ3T2G is suitable for applications that require high-speed signal processing, such as audio amplification, data acquisition, or sensor interfacing.5. Small Package Size: The LMV301SQ3T2G is available in a small SOT-23 package, which makes it suitable for space-constrained applications or designs where miniaturization is important.Application scenarios for the LMV301SQ3T2G include:1. Portable Devices: Due to its low power consumption and low voltage operation, the LMV301SQ3T2G is well-suited for portable devices such as smartphones, tablets, or wearable devices.2. Sensor Interfaces: The chip's low voltage operation and rail-to-rail input/output capabilities make it suitable for interfacing with various sensors, such as temperature sensors, pressure sensors, or light sensors.3. Audio Amplification: The wide bandwidth and rail-to-rail capabilities of the LMV301SQ3T2G make it suitable for audio amplification applications, such as headphone amplifiers or portable audio devices.4. Battery-Powered Circuits: The low power consumption of the LMV301SQ3T2G makes it ideal for battery-powered circuits, where power efficiency is crucial to extend battery life.5. Low-Power Signal Processing: The chip's low power consumption and wide bandwidth make it suitable for low-power signal processing applications, such as data acquisition systems or low-power communication circuits.Overall, the LMV301SQ3T2G integrated circuit chip offers advantages such as low power consumption, low voltage operation, rail-to-rail capabilities, and a small package size, making it suitable for a wide range of applications requiring low-power, low-voltage operation.