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TLV2461MUB

TLV2461MUB

Manufacturer No:

TLV2461MUB

Manufacturer:

Texas Instruments

Description:

IC OPAMP GP 1 CIRCUIT 10CFP

Datasheet:

Datasheet

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TLV2461MUB Specifications

  • Type
    Parameter
  • -3db Bandwidth
    -
  • Voltage - Supply Span (Max)
    6 V
  • Voltage - Supply Span (Min)
    2.7 V
  • Current - Output / Channel
    80 mA
  • Supplier Device Package
    10-CFP
  • Package / Case
    10-CDFF
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -55°C ~ 125°C (TA)
  • Current - Supply
    550µA
  • Voltage - Input Offset
    500 µV
  • Current - Input Bias
    1.3 nA
  • Gain Bandwidth Product
    6.4 MHz
  • Slew Rate
    1.6V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    1
  • Amplifier Type
    General Purpose
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    Automotive, AEC-Q100
The TLV2461MUB is a low-power, rail-to-rail input/output operational amplifier (op-amp) integrated circuit chip. Some of its advantages and application scenarios include:1. Low power consumption: The TLV2461MUB is designed to operate with very low power consumption, making it suitable for battery-powered applications or any scenario where power efficiency is crucial.2. Rail-to-rail input/output: This op-amp chip supports rail-to-rail input and output voltage ranges, allowing it to handle signals that span the entire supply voltage range. This feature is particularly useful in applications where the input or output signals need to be close to the power supply rails.3. Wide supply voltage range: The TLV2461MUB can operate with a wide supply voltage range, typically from 2.7V to 16V. This flexibility makes it compatible with a variety of power supply configurations and voltage levels.4. Low input offset voltage and low noise: The chip has low input offset voltage and low noise characteristics, which make it suitable for precision applications that require accurate signal amplification and minimal signal distortion.5. Small package size: The TLV2461MUB is available in a small package size, such as the SOT-23 or SOIC-8, which makes it suitable for space-constrained applications or designs where multiple op-amps need to be integrated into a compact circuit board.Application scenarios for the TLV2461MUB include:1. Portable devices: Due to its low power consumption and small package size, the chip is commonly used in portable devices such as smartphones, tablets, portable audio players, and wearable devices.2. Sensor interfaces: The TLV2461MUB's rail-to-rail input/output capability and low noise characteristics make it suitable for amplifying and conditioning signals from various sensors, such as temperature sensors, pressure sensors, or light sensors.3. Battery-powered systems: The low power consumption of the chip makes it ideal for battery-powered systems, such as wireless sensor networks, remote monitoring systems, or portable medical devices.4. Audio amplification: The TLV2461MUB's low noise and rail-to-rail capabilities make it suitable for audio amplification applications, such as headphone amplifiers, audio mixers, or portable audio devices.5. Industrial and automotive applications: The chip's wide supply voltage range and small package size make it suitable for various industrial and automotive applications, including motor control, instrumentation, or automotive sensor interfaces.Overall, the TLV2461MUB offers a combination of low power consumption, rail-to-rail operation, and small package size, making it versatile for a wide range of applications that require precision amplification and low power consumption.
TLV2461MUB Relevant information