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LMC6464BIN

LMC6464BIN

Manufacturer No:

LMC6464BIN

Manufacturer:

Texas Instruments

Description:

IC CMOS 4 CIRCUIT 14DIP

Datasheet:

Datasheet

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LMC6464BIN Specifications

  • Type
    Parameter
  • -3db Bandwidth
    -
  • Current - Output / Channel
    75 mA
  • Supplier Device Package
    14-PDIP
  • Package / Case
    14-DIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    -40°C ~ 85°C (TJ)
  • Voltage - Supply Span (Max)
    15.5 V
  • Voltage - Supply Span (Min)
    3 V
  • Current - Supply
    90µA (x4 Channels)
  • Voltage - Input Offset
    250 µV
  • Current - Input Bias
    0.15 pA
  • Gain Bandwidth Product
    50 kHz
  • Slew Rate
    0.028V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    4
  • Amplifier Type
    CMOS
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The LMC6464BIN is a specific type of integrated circuit chip that offers several advantages and can be used in various application scenarios. Here are some of its advantages and potential applications:Advantages: 1. Low power consumption: The LMC6464BIN chip is designed to operate with low power consumption, making it suitable for battery-powered devices or applications where power efficiency is crucial. 2. Wide supply voltage range: It can operate within a wide range of supply voltages, typically from 2.7V to 15V, providing flexibility in different power supply configurations. 3. Rail-to-rail input and output capability: The chip supports rail-to-rail input and output voltage ranges, allowing it to handle signals that span the entire supply voltage range, maximizing the dynamic range and signal fidelity. 4. High input impedance: The LMC6464BIN has a high input impedance, making it suitable for applications where the input signal source has a high output impedance or when multiple devices need to be connected to the same input. 5. Small package size: The chip is available in a small package size, making it suitable for space-constrained applications or when multiple chips need to be densely packed.Application scenarios: 1. Portable devices: The low power consumption and wide supply voltage range make the LMC6464BIN chip suitable for use in portable devices such as smartphones, tablets, or wearable devices. 2. Sensor interfaces: The high input impedance and rail-to-rail capability make it suitable for interfacing with various sensors, such as temperature sensors, pressure sensors, or light sensors. 3. Audio amplifiers: The rail-to-rail capability and small package size make it suitable for audio amplification applications, such as headphone amplifiers or small audio systems. 4. Battery management systems: The low power consumption and wide supply voltage range make it suitable for use in battery management systems, where efficient power usage and voltage monitoring are essential. 5. Industrial control systems: The chip's small package size and wide supply voltage range make it suitable for various industrial control applications, such as motor control, process control, or instrumentation.It's important to note that the specific application scenarios may vary depending on the requirements and specifications of the overall system design.
LMC6464BIN Relevant information