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AS1713-BTDT

AS1713-BTDT

Manufacturer No:

AS1713-BTDT

Manufacturer:

ams-OSRAM USA INC.

Description:

IC OPAMP DIFF 1 CIRCUIT 8MLPD

Datasheet:

Datasheet

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AS1713-BTDT Specifications

  • Type
    Parameter
  • -3db Bandwidth
    -
  • Supplier Device Package
    8-MLPD (2x2)
  • Package / Case
    8-UFDFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply Span (Max)
    5.5 V
  • Voltage - Supply Span (Min)
    2.7 V
  • Current - Output / Channel
    200 mA
  • Current - Supply
    2.3mA
  • Voltage - Input Offset
    1.5 mV
  • Current - Input Bias
    50 pA
  • Gain Bandwidth Product
    4 MHz
  • Slew Rate
    5V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    1
  • Amplifier Type
    Differential
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The AS1713-BTDT integrated circuit chips have several advantages and application scenarios:Advantages: 1. Low Power Consumption: The AS1713-BTDT chips are designed to operate with low power consumption, making them suitable for battery-powered devices and energy-efficient applications. 2. Small Form Factor: These chips are available in compact packages, enabling their integration into space-constrained designs and miniaturized devices. 3. High Integration: The AS1713-BTDT chips offer high integration of various functions, reducing the need for external components and simplifying the overall system design. 4. Bluetooth Connectivity: These chips support Bluetooth wireless communication, allowing seamless connectivity with other Bluetooth-enabled devices. 5. Cost-Effective: The AS1713-BTDT chips provide a cost-effective solution for applications that require Bluetooth connectivity and low power consumption.Application Scenarios: 1. Internet of Things (IoT) Devices: The AS1713-BTDT chips can be used in IoT devices such as smart home appliances, wearables, and industrial sensors, enabling wireless connectivity and efficient power management. 2. Wireless Audio Devices: These chips can be utilized in wireless audio devices like headphones, earbuds, and speakers, providing Bluetooth connectivity and optimized power consumption for extended battery life. 3. Health and Fitness Trackers: The AS1713-BTDT chips can be integrated into health and fitness trackers, enabling wireless data transfer to smartphones or other devices, while maintaining low power consumption for prolonged usage. 4. Home Automation Systems: These chips can be employed in home automation systems to enable wireless control and communication between various smart devices, enhancing convenience and energy efficiency. 5. Industrial Monitoring and Control: The AS1713-BTDT chips can be utilized in industrial applications for wireless monitoring and control of equipment, enabling real-time data transmission and reducing the need for wired connections.Overall, the AS1713-BTDT integrated circuit chips offer advantages such as low power consumption, small form factor, high integration, Bluetooth connectivity, and cost-effectiveness, making them suitable for a wide range of applications in IoT, audio devices, health trackers, home automation, and industrial control.
AS1713-BTDT Relevant information