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TLV2783IDG4

TLV2783IDG4

Manufacturer No:

TLV2783IDG4

Manufacturer:

Texas Instruments

Description:

IC OPAMP GP 2 CIRCUIT 14SOIC

Datasheet:

Datasheet

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TLV2783IDG4 Specifications

  • Type
    Parameter
  • -3db Bandwidth
    -
  • Supplier Device Package
    14-SOIC
  • Package / Case
    14-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Voltage - Supply Span (Max)
    3.6 V
  • Voltage - Supply Span (Min)
    1.8 V
  • Current - Output / Channel
    23 mA
  • Current - Supply
    650µA (x2 Channels)
  • Voltage - Input Offset
    250 µV
  • Current - Input Bias
    2.5 pA
  • Gain Bandwidth Product
    8 MHz
  • Slew Rate
    5V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    2
  • Amplifier Type
    General Purpose
  • Packaging
    Tube
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The TLV2783IDG4 is a low-power, rail-to-rail input/output operational amplifier integrated circuit chip. It offers several advantages and can be used in various application scenarios. Some of the advantages and application scenarios of the TLV2783IDG4 are:Advantages: 1. Low power consumption: The TLV2783IDG4 operates at a low supply current of 550μA per channel, making it suitable for battery-powered applications or any application where power efficiency is crucial. 2. Rail-to-rail input/output: It provides a wide input and output voltage range, allowing it to handle signals close to the supply rails. This feature is beneficial in applications where the input or output signals need to swing close to the power supply voltage. 3. Low input offset voltage and low input bias current: The TLV2783IDG4 has a low input offset voltage and input bias current, ensuring accurate and precise signal amplification. 4. Wide bandwidth: It offers a wide bandwidth of 10MHz, making it suitable for applications that require high-speed signal amplification.Application Scenarios: 1. Portable devices: The low power consumption and rail-to-rail input/output capability of the TLV2783IDG4 make it ideal for use in portable devices such as smartphones, tablets, and portable audio players. It can be used for audio amplification, sensor signal conditioning, or any other low-power analog signal processing. 2. Industrial instrumentation: The TLV2783IDG4 can be used in various industrial instrumentation applications, including data acquisition systems, process control, and sensor interfacing. Its low input offset voltage and low input bias current ensure accurate measurement and signal conditioning. 3. Automotive electronics: With its wide input/output voltage range and low power consumption, the TLV2783IDG4 can be used in automotive electronics applications. It can be employed in audio systems, sensor interfaces, or any other analog signal processing in vehicles. 4. Medical devices: The TLV2783IDG4 is suitable for medical devices that require low power consumption and accurate signal amplification. It can be used in patient monitoring systems, portable medical devices, or any other medical instrumentation.Overall, the TLV2783IDG4 integrated circuit chip offers low power consumption, rail-to-rail input/output, and accurate signal amplification, making it versatile for various applications in portable devices, industrial instrumentation, automotive electronics, and medical devices.
TLV2783IDG4 Relevant information