TLV2772MDG4

TLV2772MDG4

Manufacturer No:

TLV2772MDG4

Manufacturer:

Texas Instruments

Description:

IC CMOS 2 CIRCUIT 8SOIC

Datasheet:

Datasheet

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TLV2772MDG4 Specifications

  • Type
    Parameter
  • -3db Bandwidth
    -
  • Supplier Device Package
    8-SOIC
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -55°C ~ 125°C (TA)
  • Voltage - Supply Span (Max)
    5.5 V
  • Voltage - Supply Span (Min)
    2.5 V
  • Current - Output / Channel
    50 mA
  • Current - Supply
    1mA (x2 Channels)
  • Voltage - Input Offset
    360 µV
  • Current - Input Bias
    2 pA
  • Gain Bandwidth Product
    5.1 MHz
  • Slew Rate
    10.5V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    2
  • Amplifier Type
    CMOS
  • Packaging
    Tube
  • Product Status
    Discontinued at Digi-Key
  • Series
    -
The TLV2772MDG4 is a dual operational amplifier integrated circuit chip manufactured by Texas Instruments. It offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the TLV2772MDG4 are:Advantages: 1. Low noise: The TLV2772MDG4 has a low input noise voltage, which makes it suitable for applications requiring high precision and low noise amplification. 2. Low power consumption: It operates at low power supply voltages and consumes minimal power, making it suitable for battery-powered applications or low-power devices. 3. Rail-to-rail input and output: The chip supports rail-to-rail input and output voltage range, allowing it to operate with a wide range of input and output signals. 4. High bandwidth: It has a high unity-gain bandwidth, enabling it to amplify high-frequency signals accurately. 5. Wide temperature range: The TLV2772MDG4 can operate over a wide temperature range, making it suitable for applications in harsh environments.Application scenarios: 1. Sensor amplification: The low noise and high precision of the TLV2772MDG4 make it suitable for amplifying signals from various sensors, such as temperature sensors, pressure sensors, or strain gauges. 2. Audio amplification: The low distortion and high bandwidth of the chip make it suitable for audio amplification applications, such as headphone amplifiers or audio preamplifiers. 3. Signal conditioning: The TLV2772MDG4 can be used for signal conditioning in various applications, such as data acquisition systems, instrumentation, or industrial control systems. 4. Active filters: The chip can be used to implement active filters for signal processing applications, such as low-pass, high-pass, or band-pass filters. 5. Portable devices: Due to its low power consumption and small form factor, the TLV2772MDG4 is suitable for portable devices like smartphones, tablets, or wearable devices, where space and power efficiency are crucial.These are just a few examples of the advantages and application scenarios of the TLV2772MDG4 integrated circuit chip. Its versatility and performance characteristics make it suitable for a wide range of applications in various industries.