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TLV2762IDG4

TLV2762IDG4

Manufacturer No:

TLV2762IDG4

Manufacturer:

Texas Instruments

Description:

IC OPAMP GP 2 CIRCUIT 8SOIC

Datasheet:

Datasheet

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TLV2762IDG4 Specifications

  • Type
    Parameter
  • -3db Bandwidth
    -
  • Supplier Device Package
    8-SOIC
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply Span (Max)
    3.6 V
  • Voltage - Supply Span (Min)
    1.8 V
  • Current - Output / Channel
    10.2 mA
  • Current - Supply
    20µA (x2 Channels)
  • Voltage - Input Offset
    550 µV
  • Current - Input Bias
    3 pA
  • Gain Bandwidth Product
    500 kHz
  • Slew Rate
    0.23V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    2
  • Amplifier Type
    General Purpose
  • Packaging
    Tube
  • Product Status
    Discontinued at Digi-Key
  • Series
    -
The TLV2762IDG4 is a dual operational amplifier integrated circuit chip manufactured by Texas Instruments. It offers several advantages and can be used in various application scenarios. Some of the advantages and application scenarios of the TLV2762IDG4 are:Advantages: 1. Low Power Consumption: The TLV2762IDG4 has a low supply current of 550μA per channel, making it suitable for battery-powered applications and low-power designs. 2. Rail-to-Rail Input and Output: It supports rail-to-rail input and output voltage ranges, allowing it to operate with signals close to the power supply rails. This feature is beneficial in applications where the input and output signals need to cover the full range of the power supply voltage. 3. Wide Bandwidth: The TLV2762IDG4 has a wide bandwidth of 10MHz, enabling it to handle high-frequency signals accurately. 4. Low Input Offset Voltage and Low Noise: It has a low input offset voltage and low noise, ensuring precise and accurate signal amplification.Application Scenarios: 1. Portable Devices: The low power consumption and rail-to-rail input/output capabilities make the TLV2762IDG4 suitable for portable devices such as smartphones, tablets, and portable audio players. It can be used for audio amplification, signal conditioning, and filtering. 2. Sensor Interface: The low input offset voltage and low noise characteristics of the TLV2762IDG4 make it suitable for sensor interface applications. It can be used to amplify and condition signals from various sensors like temperature sensors, pressure sensors, and light sensors. 3. Industrial Control Systems: The TLV2762IDG4 can be used in industrial control systems for signal amplification, filtering, and conditioning. Its wide bandwidth and rail-to-rail capabilities make it suitable for applications such as motor control, process control, and data acquisition. 4. Medical Devices: The low power consumption and accurate signal amplification of the TLV2762IDG4 make it suitable for medical devices. It can be used in applications like patient monitoring, ECG amplification, and medical instrumentation. 5. Audio Amplification: The TLV2762IDG4 can be used in audio amplification circuits for headphones, speakers, and audio equipment. Its low noise and rail-to-rail capabilities ensure high-quality audio amplification.Overall, the TLV2762IDG4 integrated circuit chip offers low power consumption, rail-to-rail input/output, wide bandwidth, and low noise characteristics, making it suitable for a wide range of applications in portable devices, sensor interfaces, industrial control systems, medical devices, and audio amplification.
TLV2762IDG4 Relevant information