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TLV2463IDGSG4

TLV2463IDGSG4

Manufacturer No:

TLV2463IDGSG4

Manufacturer:

Texas Instruments

Description:

IC OPAMP GP 2 CIRCUIT 10VSSOP

Datasheet:

Datasheet

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TLV2463IDGSG4 Specifications

  • Type
    Parameter
  • -3db Bandwidth
    -
  • Supplier Device Package
    10-VSSOP
  • Package / Case
    10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - Supply Span (Max)
    6 V
  • Voltage - Supply Span (Min)
    2.7 V
  • Current - Output / Channel
    80 mA
  • Current - Supply
    550µA (x2 Channels)
  • Voltage - Input Offset
    500 µV
  • Current - Input Bias
    1.3 nA
  • Gain Bandwidth Product
    6.4 MHz
  • Slew Rate
    1.6V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    2
  • Amplifier Type
    General Purpose
  • Packaging
    Tube
  • Packaging
    Bulk
  • Product Status
    Obsolete
  • Series
    -
The TLV2463IDGSG4 is a low-power, rail-to-rail input/output operational amplifier integrated circuit chip. It offers several advantages and can be used in various application scenarios, including:1. Low Power Consumption: The TLV2463IDGSG4 has a low supply current of 550μA per channel, making it suitable for battery-powered applications or any system where power efficiency is crucial.2. Rail-to-Rail Input/Output: This chip supports rail-to-rail input and output voltage ranges, allowing it to operate with signals that span the entire supply voltage range. It ensures accurate signal amplification and processing even when the input or output voltage is close to the supply rails.3. Wide Bandwidth: With a bandwidth of 10MHz, the TLV2463IDGSG4 can handle high-frequency signals accurately, making it suitable for applications that require amplification or filtering of audio or RF signals.4. Low Input Bias Current: The chip has a low input bias current of 1pA, minimizing the impact of input current on the accuracy of the amplified signal. This feature is particularly useful in applications where high input impedance is required, such as sensor interfaces or transimpedance amplifiers.5. Small Package: The TLV2463IDGSG4 is available in a small 10-pin VSSOP package, which makes it suitable for space-constrained applications or designs where multiple amplifiers need to be integrated into a compact circuit board.Application scenarios for TLV2463IDGSG4 include:1. Portable Devices: Due to its low power consumption and rail-to-rail capabilities, the TLV2463IDGSG4 is commonly used in portable devices like smartphones, tablets, and portable audio players for audio amplification, filtering, or signal conditioning.2. Sensor Interfaces: The low input bias current and rail-to-rail input/output ranges make this chip suitable for amplifying and conditioning signals from various sensors, such as temperature sensors, pressure sensors, or photodiodes.3. Active Filters: The wide bandwidth and rail-to-rail capabilities of the TLV2463IDGSG4 make it suitable for active filter designs, where accurate amplification and filtering of signals are required, such as in audio applications or communication systems.4. Industrial Control Systems: The TLV2463IDGSG4 can be used in industrial control systems for signal conditioning, amplification, or as a buffer amplifier in data acquisition systems.5. Medical Devices: The low power consumption and small package size make this chip suitable for medical devices, such as portable patient monitoring systems or wearable health trackers, where power efficiency and compactness are essential.Overall, the TLV2463IDGSG4 offers low power consumption, rail-to-rail capabilities, and wide bandwidth, making it a versatile choice for various applications requiring accurate signal amplification and conditioning.
TLV2463IDGSG4 Relevant information