LMV931IDBVRG4
Manufacturer No:
LMV931IDBVRG4
Manufacturer:
Description:
IC OPAMP GP 1 CIRCUIT SOT23-5
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LMV931IDBVRG4 Specifications
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TypeParameter
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Gain Bandwidth Product1.5 MHz
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Supplier Device PackageSOT-23-5
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Package / CaseSC-74A, SOT-753
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 125°C
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Voltage - Supply Span (Max)5 V
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Voltage - Supply Span (Min)1.8 V
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Current - Supply116µA
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Voltage - Input Offset1 mV
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Current - Input Bias15 nA
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-3db Bandwidth-
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Slew Rate0.42V/µs
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Output TypeRail-to-Rail
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Number of Circuits1
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Amplifier TypeGeneral Purpose
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PackagingTape & Reel (TR)
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Product StatusObsolete
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Series-
The LMV931IDBVRG4 is a low-voltage, low-power operational amplifier integrated circuit chip. Some of its advantages and application scenarios include:1. Low voltage operation: The LMV931IDBVRG4 is designed to operate at low supply voltages, typically ranging from 1.8V to 5.5V. This makes it suitable for battery-powered applications and other low-power devices.2. Low power consumption: The chip has a low quiescent current of 20μA, making it energy-efficient and suitable for power-sensitive applications.3. Rail-to-rail input and output: The LMV931IDBVRG4 supports rail-to-rail input and output voltage ranges, allowing it to operate with signals that span the entire supply voltage range. This feature is useful in applications where the input and output signals need to be accurately reproduced.4. Small package size: The chip is available in a small SOT-23 package, which makes it suitable for space-constrained applications and allows for easy integration into compact designs.5. Wide bandwidth and fast settling time: The LMV931IDBVRG4 has a wide bandwidth of 1.4MHz and a fast settling time, making it suitable for applications that require high-speed signal processing and accurate amplification.Application scenarios for the LMV931IDBVRG4 include:1. Portable devices: The low voltage and low power consumption characteristics of the chip make it suitable for use in portable devices such as smartphones, tablets, and wearable devices.2. Sensor interfaces: The rail-to-rail input and output capability of the chip, combined with its low power consumption, make it suitable for amplifying and conditioning signals from various sensors, such as temperature sensors, pressure sensors, and light sensors.3. Audio amplification: The wide bandwidth and low power consumption of the chip make it suitable for audio amplification applications, such as headphone amplifiers and portable audio devices.4. Battery management systems: The low voltage operation and low power consumption of the chip make it suitable for use in battery management systems, where it can be used to monitor and control battery voltage levels.5. Industrial automation: The chip's small package size and low power consumption make it suitable for use in industrial automation applications, such as sensor signal conditioning, control systems, and data acquisition systems.
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