Home / Instrumentation, OP Amps, Buffer Amps / LMV821IDBVTG4/
LMV821IDBVTG4

LMV821IDBVTG4

Manufacturer No:

LMV821IDBVTG4

Manufacturer:

Texas Instruments

Description:

IC OPAMP GP 1 CIRCUIT SOT23-5

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

LMV821IDBVTG4 Specifications

  • Type
    Parameter
  • Gain Bandwidth Product
    5.5 MHz
  • Supplier Device Package
    SOT-23-5
  • Package / Case
    SC-74A, SOT-753
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Voltage - Supply Span (Max)
    5.5 V
  • Voltage - Supply Span (Min)
    2.5 V
  • Current - Supply
    300µA
  • Voltage - Input Offset
    1 mV
  • Current - Input Bias
    40 nA
  • -3db Bandwidth
    -
  • Slew Rate
    1.9V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    1
  • Amplifier Type
    General Purpose
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The LMV821IDBVTG4 is a low-voltage, low-power operational amplifier integrated circuit chip. Some of its advantages and application scenarios are:Advantages: 1. Low voltage operation: The LMV821IDBVTG4 operates at a low supply voltage range of 1.8V to 5.5V, making it suitable for battery-powered applications and low-power designs. 2. Low power consumption: It has a low quiescent current of 20μA, which helps in reducing power consumption and extending battery life. 3. Rail-to-rail input and output: The chip supports rail-to-rail input and output voltage range, allowing it to operate with signals close to the supply rails, maximizing the dynamic range and signal fidelity. 4. Low input offset voltage and low input bias current: These characteristics ensure accurate and precise signal amplification and processing. 5. Small package size: The LMV821IDBVTG4 is available in a small SOT-23 package, making it suitable for space-constrained applications.Application scenarios: 1. Portable devices: The low-voltage and low-power characteristics of the LMV821IDBVTG4 make it ideal for portable devices such as smartphones, tablets, and wearable devices, where power efficiency and extended battery life are crucial. 2. Sensor interfaces: The chip's low input offset voltage and low input bias current make it suitable for amplifying and conditioning signals from various sensors, such as temperature sensors, pressure sensors, and light sensors. 3. Audio amplification: The rail-to-rail input and output capability of the LMV821IDBVTG4 make it suitable for audio amplification applications, such as headphone amplifiers and portable audio devices. 4. Signal conditioning: The chip can be used for signal conditioning in various applications, including data acquisition systems, instrumentation, and industrial control systems. 5. Low-power designs: The LMV821IDBVTG4 can be used in low-power designs where minimizing power consumption is critical, such as energy harvesting systems, IoT devices, and wireless sensor networks.Overall, the LMV821IDBVTG4 integrated circuit chip offers low-voltage operation, low power consumption, and accurate signal processing capabilities, making it suitable for a wide range of applications requiring low-power and precision amplification.
LMV821IDBVTG4 Relevant information