Home / Instrumentation, OP Amps, Buffer Amps / LMV324SIDG4/
LMV324SIDG4

LMV324SIDG4

Manufacturer No:

LMV324SIDG4

Manufacturer:

Texas Instruments

Description:

IC OPAMP GP 4 CIRCUIT 16SOIC

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

LMV324SIDG4 Specifications

  • Type
    Parameter
  • Gain Bandwidth Product
    1 MHz
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply Span (Max)
    5.5 V
  • Voltage - Supply Span (Min)
    2.7 V
  • Current - Output / Channel
    160 mA
  • Current - Supply
    410µA (x4 Channels)
  • Voltage - Input Offset
    1.7 mV
  • Current - Input Bias
    15 nA
  • -3db Bandwidth
    -
  • Slew Rate
    1V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    4
  • Amplifier Type
    General Purpose
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    LMV®
The LMV324SIDG4 is a low-power, quad operational amplifier integrated circuit chip manufactured by Texas Instruments. It offers several advantages and can be used in various application scenarios. Some of the advantages and application scenarios of the LMV324SIDG4 are:Advantages: 1. Low Power Consumption: The LMV324SIDG4 is designed to operate at low power levels, making it suitable for battery-powered devices and applications where power efficiency is crucial. 2. Wide Supply Voltage Range: It can operate from a wide range of supply voltages, typically from 2.7V to 5.5V, allowing flexibility in different power supply configurations. 3. Rail-to-Rail Input and Output: The chip supports rail-to-rail input and output voltage ranges, enabling it to handle signals close to the power supply rails, maximizing the dynamic range and signal fidelity. 4. Low Input Offset Voltage and Low Input Bias Current: These characteristics ensure accurate and precise signal amplification, making it suitable for applications requiring high precision. 5. Small Package Size: The LMV324SIDG4 is available in small surface-mount packages, making it suitable for space-constrained applications.Application Scenarios: 1. Signal Conditioning: The LMV324SIDG4 can be used for amplifying and conditioning signals from sensors, transducers, or other low-level signal sources. Its low power consumption and rail-to-rail capabilities make it suitable for portable and battery-powered applications. 2. Audio Amplification: The chip can be used in audio amplifiers, headphone amplifiers, or audio preamplifiers due to its low noise, low distortion, and rail-to-rail capabilities. 3. Active Filters: The LMV324SIDG4 can be used in active filter circuits, such as low-pass, high-pass, or band-pass filters, to shape and process signals in various applications like audio processing, communications, or instrumentation. 4. Voltage and Current Measurement: It can be used in precision measurement applications where accurate amplification and conditioning of voltage or current signals are required. 5. Portable and Battery-Powered Devices: Due to its low power consumption and small package size, the LMV324SIDG4 is suitable for use in portable devices, battery-powered systems, and other low-power applications.It is important to note that the LMV324SIDG4's specific application suitability may vary depending on the requirements and specifications of the particular project or circuit design.
LMV324SIDG4 Relevant information