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LMV324IDRE4

LMV324IDRE4

Manufacturer No:

LMV324IDRE4

Manufacturer:

Texas Instruments

Description:

IC OPAMP GP 4 CIRCUIT 14SOIC

Datasheet:

Datasheet

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LMV324IDRE4 Specifications

  • Type
    Parameter
  • Gain Bandwidth Product
    1 MHz
  • Supplier Device Package
    14-SOIC
  • Package / Case
    14-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - Supply Span (Max)
    5.5 V
  • Voltage - Supply Span (Min)
    2.7 V
  • Current - Output / Channel
    40 mA
  • Current - Supply
    410µA (x4 Channels)
  • Voltage - Input Offset
    1.7 mV
  • Current - Input Bias
    15 nA
  • -3db Bandwidth
    -
  • Slew Rate
    1V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    4
  • Amplifier Type
    General Purpose
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Discontinued at Digi-Key
  • Series
    -
The LMV324IDRE4 is a low-power, quad operational amplifier integrated circuit chip. Some of its advantages and application scenarios include:1. Low power consumption: The LMV324IDRE4 is designed to operate with low power consumption, making it suitable for battery-powered devices and applications where power efficiency is crucial.2. Wide supply voltage range: It can operate with a wide supply voltage range, typically from 2.7V to 5.5V. This flexibility allows it to be used in various electronic systems with different power supply configurations.3. Rail-to-rail input and output: The chip supports rail-to-rail input and output voltage ranges, enabling it to handle signals that span the entire supply voltage range. This feature is particularly useful in applications where the input and output signals need to be accurately amplified and processed.4. Low input offset voltage and low input bias current: The LMV324IDRE4 has low input offset voltage and input bias current, which ensures accurate amplification and minimal distortion in signal processing applications.5. Small package size: The chip is available in a small package size, such as the SOIC-14 package, which makes it suitable for space-constrained applications.Application scenarios for the LMV324IDRE4 include:1. Portable devices: Due to its low power consumption and small package size, the chip is commonly used in portable devices like smartphones, tablets, and portable audio players.2. Sensor interfaces: The LMV324IDRE4 can be used in sensor interface circuits to amplify and process signals from various sensors, such as temperature sensors, pressure sensors, and light sensors.3. Signal conditioning: It can be used in signal conditioning circuits to amplify weak signals from sensors or other sources before further processing or analysis.4. Audio amplification: The chip can be used in audio amplifiers for applications like headphones, portable speakers, and audio systems.5. Industrial control systems: The LMV324IDRE4 can be used in various industrial control systems, such as motor control, process control, and instrumentation, where low power consumption and accurate signal processing are required.Overall, the LMV324IDRE4 integrated circuit chip offers low power consumption, rail-to-rail operation, and small package size, making it suitable for a wide range of applications that require accurate signal amplification and processing in a compact and power-efficient form.
LMV324IDRE4 Relevant information