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TLV2773IDGS

TLV2773IDGS

Manufacturer No:

TLV2773IDGS

Manufacturer:

Texas Instruments

Description:

IC CMOS 2 CIRCUIT 10VSSOP

Datasheet:

Datasheet

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TLV2773IDGS Specifications

  • Type
    Parameter
  • -3db Bandwidth
    -
  • Supplier Device Package
    10-VSSOP
  • Package / Case
    10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Voltage - Supply Span (Max)
    5.5 V
  • Voltage - Supply Span (Min)
    2.5 V
  • Current - Output / Channel
    50 mA
  • Current - Supply
    1mA (x2 Channels)
  • Voltage - Input Offset
    700 µV
  • Current - Input Bias
    2 pA
  • Gain Bandwidth Product
    5.1 MHz
  • Slew Rate
    10.5V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    2
  • Amplifier Type
    CMOS
  • Packaging
    Tube
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The TLV2773IDGS is a dual operational amplifier integrated circuit chip manufactured by Texas Instruments. It offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the TLV2773IDGS chip are:Advantages: 1. Low power consumption: The TLV2773IDGS chip operates at a low supply current of 550μA per channel, making it suitable for battery-powered applications and energy-efficient designs. 2. Rail-to-rail input and output: It supports rail-to-rail input and output voltage ranges, allowing it to operate with signals close to the power supply rails, maximizing the dynamic range and signal fidelity. 3. Wide supply voltage range: The chip can operate from a single supply voltage as low as 2.7V up to a maximum of 16V, providing flexibility in various applications. 4. Low input offset voltage and low noise: The TLV2773IDGS chip offers low input offset voltage and low noise, enabling accurate and high-fidelity signal amplification. 5. High slew rate and bandwidth: It provides a high slew rate of 3.6V/μs and a wide bandwidth of 10MHz, making it suitable for applications requiring fast signal processing and amplification.Application Scenarios: 1. Portable and battery-powered devices: The low power consumption and wide supply voltage range make the TLV2773IDGS chip suitable for applications such as portable audio devices, handheld instruments, and battery-powered sensors. 2. Signal conditioning and amplification: With its rail-to-rail input and output capabilities, low noise, and high bandwidth, the chip can be used for signal conditioning and amplification in various applications, including data acquisition systems, medical instrumentation, and industrial control systems. 3. Sensor interfaces: The TLV2773IDGS chip can be used to interface with various sensors, such as temperature sensors, pressure sensors, and light sensors, due to its low power consumption, low noise, and accurate amplification capabilities. 4. Audio amplification: The chip's low noise, high slew rate, and wide bandwidth make it suitable for audio amplification applications, including headphone amplifiers, audio mixers, and portable audio devices. 5. Active filters and equalizers: The TLV2773IDGS chip can be used in active filter and equalizer circuits due to its high bandwidth, low noise, and accurate amplification characteristics.These advantages and application scenarios demonstrate the versatility and usefulness of the TLV2773IDGS integrated circuit chip in various electronic designs.
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