TLV271IDBVRG4
Manufacturer No:
TLV271IDBVRG4
Manufacturer:
Description:
IC CMOS 1 CIRCUIT SOT23-5
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TLV271IDBVRG4 Specifications
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TypeParameter
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Supplier Device PackageSOT-23-5
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Package / CaseSC-74A, SOT-753
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 125°C
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Voltage - Supply Span (Max)16 V
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Voltage - Supply Span (Min)2.7 V
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Current - Output / Channel8 mA
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Current - Supply625µA
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Voltage - Input Offset500 µV
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Current - Input Bias1 pA
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Gain Bandwidth Product3 MHz
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Slew Rate2.6V/µs
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Output TypeRail-to-Rail
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Number of Circuits1
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Amplifier TypeCMOS
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PackagingTape & Reel (TR)
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Product StatusObsolete
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Series-
The TLV271IDBVRG4 is a low-power operational amplifier integrated circuit chip manufactured by Texas Instruments. It offers several advantages and can be used in various application scenarios. Some of the advantages and application scenarios of the TLV271IDBVRG4 are:Advantages: 1. Low power consumption: The TLV271IDBVRG4 operates at a low supply current of 900μA, making it suitable for battery-powered devices and low-power applications. 2. Rail-to-rail input and output: It supports rail-to-rail input and output voltage ranges, allowing it to operate with signals close to the power supply rails, maximizing the dynamic range and signal fidelity. 3. Wide supply voltage range: The chip can operate from a single supply voltage ranging from 2.7V to 16V, providing flexibility in various power supply configurations. 4. Low input offset voltage and low input bias current: These characteristics ensure accurate and precise signal amplification, making it suitable for applications requiring high precision. 5. Small package size: The TLV271IDBVRG4 is available in a small SOT-23 package, which is ideal for space-constrained applications.Application Scenarios: 1. Portable devices: The low power consumption and wide supply voltage range make the TLV271IDBVRG4 suitable for portable devices such as smartphones, tablets, and portable audio players. 2. Sensor amplification: The low input offset voltage and low input bias current make it suitable for amplifying small signals from sensors, such as temperature sensors, pressure sensors, or light sensors. 3. Battery-powered systems: The low power consumption and rail-to-rail input/output capabilities make it suitable for battery-powered systems, such as wireless sensor networks, remote monitoring systems, or portable medical devices. 4. Signal conditioning: The TLV271IDBVRG4 can be used for signal conditioning in various applications, including data acquisition systems, instrumentation, and control systems. 5. Audio amplification: The rail-to-rail input/output capability and low distortion make it suitable for audio amplification applications, such as headphone amplifiers, audio mixers, or portable audio devices.These are just a few examples of the advantages and application scenarios of the TLV271IDBVRG4 integrated circuit chip. Its versatility, low power consumption, and precision make it suitable for a wide range of applications in various industries.
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