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TLV2470IDBVRG4

TLV2470IDBVRG4

Manufacturer No:

TLV2470IDBVRG4

Manufacturer:

Texas Instruments

Description:

IC OPAMP GP 1 CIRCUIT SOT23-6

Datasheet:

Datasheet

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TLV2470IDBVRG4 Specifications

  • Type
    Parameter
  • Supplier Device Package
    SOT-23-6
  • Package / Case
    SOT-23-6
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Voltage - Supply Span (Max)
    6 V
  • Voltage - Supply Span (Min)
    2.7 V
  • Current - Output / Channel
    35 mA
  • Current - Supply
    600µA
  • Voltage - Input Offset
    250 µV
  • Current - Input Bias
    2.5 pA
  • Gain Bandwidth Product
    2.8 MHz
  • Slew Rate
    1.5V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    1
  • Amplifier Type
    General Purpose
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Discontinued at Digi-Key
  • Series
    -
The TLV2470IDBVRG4 is a low-power, low-noise operational amplifier integrated circuit chip. Some of its advantages and application scenarios include:1. Low power consumption: The TLV2470IDBVRG4 is designed to operate with low power consumption, making it suitable for battery-powered applications or any application where power efficiency is crucial.2. Low noise: This chip has a low input voltage noise density, which makes it ideal for applications that require high precision and low noise amplification, such as audio amplifiers, medical instrumentation, and sensor signal conditioning.3. Wide bandwidth: The TLV2470IDBVRG4 offers a wide bandwidth, enabling it to handle high-frequency signals accurately. This makes it suitable for applications like high-speed data acquisition, communication systems, and signal processing.4. Rail-to-rail input and output: This chip supports rail-to-rail input and output voltage range, allowing it to operate with signals that span the entire supply voltage range. It is useful in applications where the input or output signals need to be close to the power supply rails, such as battery monitoring, sensor interfaces, and audio amplification.5. Small package size: The TLV2470IDBVRG4 is available in a small SOT-23 package, which makes it suitable for space-constrained applications or designs where multiple amplifiers need to be integrated into a compact form factor.Overall, the TLV2470IDBVRG4 integrated circuit chip is advantageous for low-power, low-noise, and high-precision applications that require wide bandwidth and rail-to-rail operation.
TLV2470IDBVRG4 Relevant information