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TLV341IDBVT

TLV341IDBVT

Manufacturer No:

TLV341IDBVT

Manufacturer:

Texas Instruments

Description:

IC OPAMP GP 1 CIRCUIT SOT23-6

Datasheet:

Datasheet

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TLV341IDBVT Specifications

  • Type
    Parameter
  • -3db Bandwidth
    -
  • Supplier Device Package
    SOT-23-6
  • Package / Case
    SOT-23-6
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Voltage - Supply Span (Max)
    5.5 V
  • Voltage - Supply Span (Min)
    1.5 V
  • Current - Output / Channel
    115 mA
  • Current - Supply
    75µA
  • Voltage - Input Offset
    300 µV
  • Current - Input Bias
    1 pA
  • Gain Bandwidth Product
    2.3 MHz
  • Slew Rate
    1V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    1
  • Amplifier Type
    General Purpose
  • Packaging
    Bulk
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The TLV341IDBVT is a low-power, rail-to-rail input/output operational amplifier integrated circuit chip. It offers several advantages and can be used in various application scenarios. Some of the advantages and application scenarios of the TLV341IDBVT are:Advantages: 1. Low power consumption: The TLV341IDBVT operates at a low supply current of 550μA, making it suitable for battery-powered devices and applications where power efficiency is crucial. 2. Rail-to-rail input/output: It provides a wide input and output voltage range, allowing it to handle signals that are close to the supply rails. This feature is beneficial in applications where the input/output signals need to swing close to the power supply voltage. 3. High precision: The TLV341IDBVT offers a high open-loop gain and low offset voltage, resulting in accurate amplification and signal processing. 4. Small package size: It is available in a small SOT-23 package, making it suitable for space-constrained applications.Application Scenarios: 1. Portable devices: The low power consumption and small package size of the TLV341IDBVT make it ideal for use in portable devices such as smartphones, tablets, and wearable devices. It can be used for audio amplification, sensor signal conditioning, and other low-power analog signal processing tasks. 2. Industrial automation: The TLV341IDBVT can be used in industrial automation systems for signal conditioning, amplification, and filtering. Its rail-to-rail input/output capability allows it to handle a wide range of sensor signals accurately. 3. Medical devices: In medical devices like patient monitoring systems, the TLV341IDBVT can be used for amplifying and processing bio-potential signals such as ECG (electrocardiogram) and EEG (electroencephalogram). Its low power consumption is beneficial for battery-powered medical devices. 4. Automotive electronics: The TLV341IDBVT can be employed in automotive electronics for various applications, including sensor signal conditioning, audio amplification, and control systems. Its rail-to-rail input/output capability enables accurate signal processing in the presence of varying supply voltages.Overall, the TLV341IDBVT integrated circuit chip offers low power consumption, rail-to-rail input/output, high precision, and small package size, making it suitable for a wide range of applications in portable devices, industrial automation, medical devices, and automotive electronics.
TLV341IDBVT Relevant information