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LPV324DRE4

LPV324DRE4

Manufacturer No:

LPV324DRE4

Manufacturer:

Texas Instruments

Description:

IC OPAMP GP 4 CIRCUIT 14SOIC

Datasheet:

Datasheet

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LPV324DRE4 Specifications

  • Type
    Parameter
  • -3db Bandwidth
    -
  • Current - Output / Channel
    72 mA
  • Supplier Device Package
    14-SOIC
  • Package / Case
    14-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply Span (Max)
    5 V
  • Voltage - Supply Span (Min)
    2.7 V
  • Current - Supply
    28µA (x4 Channels)
  • Voltage - Input Offset
    1.5 mV
  • Current - Input Bias
    2 nA
  • Gain Bandwidth Product
    237 kHz
  • Slew Rate
    0.1V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    4
  • Amplifier Type
    General Purpose
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The LPV324DRE4 is a low-power, low-voltage operational amplifier integrated circuit chip. Some of its advantages and application scenarios include:1. Low power consumption: The LPV324DRE4 is designed to operate at low power levels, making it suitable for battery-powered devices and applications where power efficiency is crucial.2. Low voltage operation: This chip can operate at low supply voltages, typically ranging from 2.7V to 5.5V. It is ideal for applications that require low voltage operation, such as portable electronics and low-power sensor circuits.3. Rail-to-rail input and output: The LPV324DRE4 offers rail-to-rail input and output capabilities, meaning it can handle signals that swing close to the supply voltage rails. This feature is useful in applications where the input and output signals need to cover the full range of the power supply voltage.4. Wide temperature range: This chip is designed to operate over a wide temperature range, typically from -40°C to 125°C. It is suitable for applications that require operation in extreme temperature conditions, such as automotive electronics and industrial control systems.5. Small package size: The LPV324DRE4 is available in small package options, such as the SOIC-14 package. This compact size makes it suitable for space-constrained applications, including portable devices and miniaturized electronic systems.Application scenarios for the LPV324DRE4 include:1. Portable electronics: The low power consumption and low voltage operation of this chip make it suitable for various portable devices, such as smartphones, tablets, and wearable devices.2. Sensor interfaces: The LPV324DRE4 can be used in sensor interface circuits, where low power consumption and rail-to-rail operation are essential for accurate signal conditioning and amplification.3. Battery-powered systems: Due to its low power requirements, this chip is well-suited for battery-powered systems, such as wireless sensors, remote monitoring devices, and IoT applications.4. Automotive electronics: The wide temperature range and small package size of the LPV324DRE4 make it suitable for automotive electronics, including engine control units, dashboard displays, and sensor interfaces.5. Industrial control systems: The LPV324DRE4 can be used in industrial control systems that require low power consumption, wide temperature range, and compact size, such as motor control circuits, process control systems, and data acquisition systems.
LPV324DRE4 Relevant information