LMV824DRE4
Manufacturer No:
LMV824DRE4
Manufacturer:
Description:
IC OPAMP GP 4 CIRCUIT 14SOIC
Datasheet:
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LMV824DRE4 Specifications
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TypeParameter
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-3db Bandwidth-
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Current - Output / Channel45 mA
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Supplier Device Package14-SOIC
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Package / Case14-SOIC (0.154", 3.90mm Width)
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C
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Voltage - Supply Span (Max)5.5 V
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Voltage - Supply Span (Min)2.5 V
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Current - Supply1mA
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Voltage - Input Offset1 mV
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Current - Input Bias40 nA
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Gain Bandwidth Product5.5 MHz
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Slew Rate1.9V/µs
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Output TypeRail-to-Rail
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Number of Circuits4
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Amplifier TypeGeneral Purpose
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PackagingTape & Reel (TR)
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Product StatusObsolete
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SeriesLMV®
The LMV824DRE4 is a low-voltage, low-power operational amplifier integrated circuit chip. Some of its advantages and application scenarios are:1. Low voltage operation: The LMV824DRE4 operates at a low supply voltage range of 2.7V to 5.5V, making it suitable for battery-powered applications and low-power designs.2. Low power consumption: With a low quiescent current of 50μA per channel, the LMV824DRE4 is energy-efficient and helps extend battery life in portable devices.3. Rail-to-rail input and output: The chip supports rail-to-rail input and output voltage ranges, allowing it to handle signals close to the supply rails. This feature is useful in applications where the input or output voltage range is limited.4. Wide bandwidth and fast settling time: The LMV824DRE4 has a wide bandwidth of 10MHz and a fast settling time, making it suitable for applications requiring high-speed signal processing and accurate amplification.5. Small package size: The chip is available in small packages like the SOIC-14, making it suitable for space-constrained applications.Application scenarios for the LMV824DRE4 include:1. Portable devices: The low voltage and low power consumption make it ideal for use in portable devices such as smartphones, tablets, and wearable devices.2. Sensor interfaces: The rail-to-rail input and output capability, along with the wide bandwidth, make the chip suitable for amplifying and conditioning signals from various sensors like temperature sensors, pressure sensors, and light sensors.3. Audio amplification: The LMV824DRE4 can be used in audio amplification circuits for applications like headphones, portable speakers, and audio recording devices.4. Signal conditioning: The chip can be used for signal conditioning in various applications, including data acquisition systems, instrumentation, and industrial control systems.5. Battery-powered systems: The low voltage operation and low power consumption make the chip suitable for battery-powered systems such as wireless sensors, remote monitoring devices, and IoT applications.Overall, the LMV824DRE4 integrated circuit chip offers advantages such as low voltage operation, low power consumption, rail-to-rail capability, and small package size, making it versatile for a wide range of applications requiring low-power and low-voltage amplification and signal conditioning.
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