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LMV722IDGKRG4

LMV722IDGKRG4

Manufacturer No:

LMV722IDGKRG4

Manufacturer:

Texas Instruments

Description:

IC OPAMP GP 2 CIRCUIT 8VSSOP

Datasheet:

Datasheet

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LMV722IDGKRG4 Specifications

  • Type
    Parameter
  • -3db Bandwidth
    -
  • Current - Output / Channel
    52.6 mA
  • Supplier Device Package
    8-VSSOP
  • Package / Case
    8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -45°C ~ 105°C
  • Voltage - Supply Span (Max)
    5.5 V
  • Voltage - Supply Span (Min)
    2.2 V
  • Current - Supply
    1.81mA (x2 Channels)
  • Voltage - Input Offset
    80 µV
  • Current - Input Bias
    260 nA
  • Gain Bandwidth Product
    10 MHz
  • Slew Rate
    5.25V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    2
  • Amplifier Type
    General Purpose
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    LMV®
The LMV722IDGKRG4 is a low-voltage, low-power dual operational amplifier integrated circuit chip. Some of its advantages and application scenarios include:1. Low voltage operation: The LMV722IDGKRG4 operates at a low supply voltage range of 2.7V to 5.5V, making it suitable for battery-powered applications and low-power circuits.2. Low power consumption: With a low quiescent current of 40μA per amplifier, the LMV722IDGKRG4 is energy-efficient and helps extend battery life in portable devices.3. Rail-to-rail input and output: The chip supports rail-to-rail input and output voltage ranges, allowing it to handle signals close to the supply voltage rails. This feature is useful in applications where the input or output signals need to swing close to the supply voltage limits.4. Wide bandwidth and fast settling time: The LMV722IDGKRG4 offers a wide bandwidth of 10MHz and a fast settling time of 1.2μs, making it suitable for applications that require high-speed signal processing and accurate amplification.5. Small package size: The chip is available in a small MSOP-8 package, which saves board space and enables compact designs.Application scenarios for the LMV722IDGKRG4 include:1. Portable devices: The low voltage and low power consumption make it suitable for use in battery-powered devices such as smartphones, tablets, portable audio players, and wearable devices.2. Sensor interfaces: The rail-to-rail input and output capability, along with the wide bandwidth, make the chip suitable for amplifying and conditioning signals from various sensors, such as temperature sensors, pressure sensors, and light sensors.3. Audio amplification: The LMV722IDGKRG4 can be used in audio amplification circuits, such as headphone amplifiers, line drivers, and audio mixers, where low voltage operation and low power consumption are important.4. Signal conditioning: The chip can be used for signal conditioning in various applications, including data acquisition systems, instrumentation, and industrial control systems.5. Active filters: The wide bandwidth and fast settling time make the LMV722IDGKRG4 suitable for active filter circuits, such as low-pass filters, high-pass filters, and band-pass filters, used in audio processing, communications, and measurement systems.
LMV722IDGKRG4 Relevant information