Home / Instrumentation, OP Amps, Buffer Amps / LMV341IDBVRE4/
LMV341IDBVRE4

LMV341IDBVRE4

Manufacturer No:

LMV341IDBVRE4

Manufacturer:

Texas Instruments

Description:

IC OPAMP GP 1 CIRCUIT SOT23-6

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

LMV341IDBVRE4 Specifications

  • Type
    Parameter
  • Gain Bandwidth Product
    1 MHz
  • Supplier Device Package
    SOT-23-6
  • Package / Case
    SOT-23-6
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Voltage - Supply Span (Max)
    5.5 V
  • Voltage - Supply Span (Min)
    2.5 V
  • Current - Supply
    107µA
  • Voltage - Input Offset
    250 µV
  • Current - Input Bias
    1 pA
  • -3db Bandwidth
    -
  • Slew Rate
    1V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    1
  • Amplifier Type
    General Purpose
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The LMV341IDBVRE4 is a low-voltage, low-power operational amplifier integrated circuit chip. Some of its advantages and application scenarios include:1. Low voltage operation: The LMV341IDBVRE4 is designed to operate at low supply voltages, typically ranging from 2.7V to 5.5V. This makes it suitable for battery-powered applications and other low-power devices.2. Low power consumption: The chip has a low quiescent current of 20μA, making it energy-efficient and suitable for power-sensitive applications.3. Rail-to-rail input and output: The LMV341IDBVRE4 supports rail-to-rail input and output voltage ranges, allowing it to operate with signals that span the entire supply voltage range. This feature is useful in applications where the input or output signals need to be close to the supply rails.4. Small package size: The chip is available in a small SOT-23 package, which makes it suitable for space-constrained applications and allows for easy integration into compact designs.5. Wide temperature range: The LMV341IDBVRE4 can operate over a wide temperature range, typically from -40°C to 125°C, making it suitable for use in harsh environments.Application scenarios for the LMV341IDBVRE4 include:1. Portable devices: The low voltage and low power consumption make it suitable for use in portable devices such as smartphones, tablets, and wearable devices.2. Sensor interfaces: The rail-to-rail input and output capability, along with the low power consumption, make it suitable for interfacing with sensors in applications such as industrial automation, medical devices, and environmental monitoring.3. Battery-powered systems: The low voltage operation and low power consumption make it ideal for use in battery-powered systems, such as wireless sensor networks, remote monitoring systems, and IoT devices.4. Audio amplification: The rail-to-rail input and output capability, along with the small package size, make it suitable for audio amplification applications, such as headphones, portable speakers, and audio interfaces.5. Automotive electronics: The wide temperature range and small package size make it suitable for automotive applications, such as infotainment systems, dashboard displays, and sensor interfaces.Overall, the LMV341IDBVRE4 integrated circuit chip offers advantages such as low voltage operation, low power consumption, rail-to-rail input and output, small package size, and wide temperature range, making it suitable for a wide range of applications in various industries.
LMV341IDBVRE4 Relevant information