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LMV324SIDRE4

LMV324SIDRE4

Manufacturer No:

LMV324SIDRE4

Manufacturer:

Texas Instruments

Description:

IC OPAMP GP 4 CIRCUIT 16SOIC

Datasheet:

Datasheet

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LMV324SIDRE4 Specifications

  • Type
    Parameter
  • Gain Bandwidth Product
    1 MHz
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply Span (Max)
    5.5 V
  • Voltage - Supply Span (Min)
    2.7 V
  • Current - Output / Channel
    160 mA
  • Current - Supply
    410µA (x4 Channels)
  • Voltage - Input Offset
    1.7 mV
  • Current - Input Bias
    15 nA
  • -3db Bandwidth
    -
  • Slew Rate
    1V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    4
  • Amplifier Type
    General Purpose
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    LMV®
The LMV324SIDRE4 is a low-power, low-voltage quad operational amplifier integrated circuit chip. Some of its advantages and application scenarios include:1. Low power consumption: The LMV324SIDRE4 is designed to operate at low power levels, making it suitable for battery-powered devices and applications where power efficiency is crucial.2. Low voltage operation: This chip can operate at low supply voltages, typically ranging from 2.7V to 5.5V. It is ideal for applications where the available power supply is limited.3. Quad operational amplifier: The LMV324SIDRE4 contains four independent operational amplifiers in a single package. This makes it suitable for applications that require multiple amplifiers, such as signal conditioning, filtering, and amplification.4. Rail-to-rail input and output: The chip supports rail-to-rail input and output voltage ranges, allowing it to handle signals that span the entire supply voltage range. This feature is useful in applications where the input or output signals can approach the power supply rails.5. Wide bandwidth and high slew rate: The LMV324SIDRE4 offers a wide bandwidth and high slew rate, enabling it to accurately amplify high-frequency signals without distortion. This makes it suitable for audio amplification, sensor interfaces, and other applications that require high-speed signal processing.6. Small package size: The chip is available in small surface-mount packages, such as the SOIC-14, which saves board space and allows for compact designs.Application scenarios for the LMV324SIDRE4 include:1. Portable devices: Due to its low power consumption and low voltage operation, the chip is commonly used in portable devices like smartphones, tablets, and wearable devices.2. Sensor interfaces: The LMV324SIDRE4 can be used to interface with various sensors, such as temperature sensors, pressure sensors, and light sensors. It can amplify and condition the sensor signals for further processing.3. Audio amplification: The chip's wide bandwidth and high slew rate make it suitable for audio amplification applications, such as headphone amplifiers, audio mixers, and portable speakers.4. Industrial control systems: The LMV324SIDRE4 can be used in industrial control systems for signal conditioning, amplification, and filtering tasks. It is commonly employed in motor control, process control, and instrumentation applications.5. Automotive electronics: The chip's low voltage operation and small package size make it suitable for automotive electronics, including infotainment systems, engine control units, and sensor interfaces.Overall, the LMV324SIDRE4 integrated circuit chip offers low power consumption, low voltage operation, multiple amplifiers, rail-to-rail capabilities, and high-speed signal processing, making it versatile for a wide range of applications.
LMV324SIDRE4 Relevant information