Home / Instrumentation, OP Amps, Buffer Amps / LMV324SID/
LMV324SID

LMV324SID

Manufacturer No:

LMV324SID

Manufacturer:

Texas Instruments

Description:

IC OPAMP GP 4 CIRCUIT 16SOIC

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

LMV324SID Specifications

  • Type
    Parameter
  • Gain Bandwidth Product
    1 MHz
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply Span (Max)
    5.5 V
  • Voltage - Supply Span (Min)
    2.7 V
  • Current - Output / Channel
    160 mA
  • Current - Supply
    410µA (x4 Channels)
  • Voltage - Input Offset
    1.7 mV
  • Current - Input Bias
    15 nA
  • -3db Bandwidth
    -
  • Slew Rate
    1V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    4
  • Amplifier Type
    General Purpose
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    LMV®
The LMV324SID is a low-power, quad operational amplifier integrated circuit chip. It offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the LMV324SID are:Advantages: 1. Low power consumption: The LMV324SID is designed to operate at low power levels, making it suitable for battery-powered devices and applications where power efficiency is crucial. 2. Wide supply voltage range: It can operate with a wide range of supply voltages, typically from 2.7V to 5.5V, allowing flexibility in different power supply configurations. 3. Rail-to-rail input and output: The chip supports rail-to-rail input and output voltage ranges, enabling it to handle signals close to the power supply rails, maximizing the dynamic range and minimizing distortion. 4. Low input offset voltage and low input bias current: These characteristics ensure accurate and precise signal amplification, making it suitable for applications that require high precision. 5. Small package size: The LMV324SID is available in small surface-mount packages, making it suitable for space-constrained applications.Application scenarios: 1. Portable devices: Due to its low power consumption and small package size, the LMV324SID is commonly used in portable devices such as smartphones, tablets, portable media players, and wearable devices. 2. Sensor interfaces: The low input offset voltage and low input bias current make the LMV324SID suitable for amplifying and conditioning signals from various sensors, including temperature sensors, pressure sensors, and light sensors. 3. Audio amplification: The rail-to-rail input and output capability of the chip make it suitable for audio amplification applications, such as headphone amplifiers, portable speakers, and audio mixers. 4. Battery management systems: The low power consumption and wide supply voltage range make the LMV324SID suitable for battery management systems, including battery voltage monitoring, charge control, and power management. 5. Industrial control systems: The LMV324SID can be used in industrial control systems for signal conditioning, amplification, and control applications, such as motor control, process control, and instrumentation.These are just a few examples of the advantages and application scenarios of the LMV324SID integrated circuit chip. Its versatility, low power consumption, and small package size make it suitable for a wide range of applications in various industries.
LMV324SID Relevant information