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TLV2783AID

TLV2783AID

Manufacturer No:

TLV2783AID

Manufacturer:

Texas Instruments

Description:

IC OPAMP GP 2 CIRCUIT 14SOIC

Datasheet:

Datasheet

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TLV2783AID Specifications

  • Type
    Parameter
  • -3db Bandwidth
    -
  • Supplier Device Package
    14-SOIC
  • Package / Case
    14-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Voltage - Supply Span (Max)
    3.6 V
  • Voltage - Supply Span (Min)
    1.8 V
  • Current - Output / Channel
    23 mA
  • Current - Supply
    650µA (x2 Channels)
  • Voltage - Input Offset
    250 µV
  • Current - Input Bias
    2.5 pA
  • Gain Bandwidth Product
    8 MHz
  • Slew Rate
    5V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    2
  • Amplifier Type
    General Purpose
  • Packaging
    Tube
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The TLV2783AID is a low-power, rail-to-rail input/output operational amplifier (op-amp) integrated circuit chip. It offers several advantages and can be used in various application scenarios. Some of the advantages and application scenarios of the TLV2783AID are:Advantages: 1. Low power consumption: The TLV2783AID is designed to operate with low power consumption, making it suitable for battery-powered devices and applications where power efficiency is crucial. 2. Rail-to-rail input/output: This op-amp chip supports rail-to-rail input and output voltage ranges, allowing it to handle signals that span the entire supply voltage range. This feature is beneficial in applications where the input or output signals need to be close to the power supply rails. 3. Wide supply voltage range: The TLV2783AID can operate with a wide supply voltage range, typically from 2.7V to 16V. This flexibility makes it compatible with various power supply configurations. 4. Low input offset voltage and low noise: The chip has low input offset voltage and low noise characteristics, enabling accurate and high-fidelity signal processing.Application Scenarios: 1. Portable and battery-powered devices: The low power consumption and wide supply voltage range of the TLV2783AID make it suitable for use in portable and battery-powered devices such as smartphones, tablets, portable audio players, and wearable devices. 2. Sensor signal conditioning: The rail-to-rail input/output capability and low input offset voltage of the chip make it suitable for sensor signal conditioning applications. It can accurately amplify and process signals from various sensors like temperature sensors, pressure sensors, and light sensors. 3. Audio amplification: The TLV2783AID can be used in audio amplification circuits, such as headphone amplifiers, audio mixers, and preamplifiers. Its low noise characteristics and rail-to-rail capability help in achieving high-quality audio output. 4. Industrial and automotive applications: The chip's wide supply voltage range and robustness make it suitable for industrial and automotive applications. It can be used in motor control, power management, and signal conditioning circuits in these environments.Overall, the TLV2783AID integrated circuit chip offers low power consumption, rail-to-rail capability, and wide supply voltage range, making it versatile for various applications requiring accurate signal processing and low noise amplification.
TLV2783AID Relevant information