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TLV2783CD

TLV2783CD

Manufacturer No:

TLV2783CD

Manufacturer:

Texas Instruments

Description:

IC OPAMP GP 2 CIRCUIT 14SOIC

Datasheet:

Datasheet

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TLV2783CD Specifications

  • Type
    Parameter
  • Current - Output / Channel
    23 mA
  • Voltage - Input Offset
    250 µV
  • Current - Input Bias
    2.5 pA
  • Gain Bandwidth Product
    8 MHz
  • Supplier Device Package
    14-SOIC
  • Package / Case
    14-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C
  • Voltage - Supply Span (Max)
    3.6 V
  • Voltage - Supply Span (Min)
    1.8 V
  • Current - Supply
    650µA (x2 Channels)
  • -3db Bandwidth
    -
  • Slew Rate
    5V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    2
  • Amplifier Type
    General Purpose
  • Packaging
    Tube
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The TLV2783CD is a specific model of integrated circuit chip manufactured by Texas Instruments. It is a low-power, rail-to-rail input/output operational amplifier. Here are some advantages and application scenarios of the TLV2783CD:Advantages: 1. Low power consumption: The TLV2783CD is designed to operate with low power consumption, making it suitable for battery-powered devices or applications where power efficiency is crucial. 2. Rail-to-rail input/output: This feature allows the amplifier to accept and deliver signals that are close to the power supply rails, maximizing the dynamic range and minimizing distortion. 3. Wide supply voltage range: The TLV2783CD can operate with a wide range of supply voltages, typically from 2.7V to 16V, making it versatile and compatible with various power sources. 4. High-speed performance: It offers a high slew rate and fast settling time, enabling it to handle fast-changing signals accurately.Application scenarios: 1. Portable devices: The low power consumption and wide supply voltage range make the TLV2783CD suitable for use in portable devices such as smartphones, tablets, portable audio players, and wearable devices. 2. Sensor interfaces: The rail-to-rail input/output capability and high-speed performance make it ideal for amplifying and conditioning signals from various sensors, such as temperature sensors, pressure sensors, or light sensors. 3. Signal conditioning: The TLV2783CD can be used for signal conditioning in various applications, including data acquisition systems, industrial automation, and control systems. 4. Audio amplification: It can be used in audio amplifiers, headphone amplifiers, or audio mixers, where the rail-to-rail input/output and low distortion characteristics are important. 5. Battery management: The low power consumption and wide supply voltage range make it suitable for battery management circuits, battery chargers, or power management systems.These are just a few examples of the advantages and application scenarios of the TLV2783CD integrated circuit chip. The specific usage will depend on the requirements of the system or device being designed.
TLV2783CD Relevant information