Home / Instrumentation, OP Amps, Buffer Amps / 3650KG/
3650KG

3650KG

Manufacturer No:

3650KG

Manufacturer:

Texas Instruments

Description:

IC OPAMP ISOLATION 1 CIRC 32CDIP

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

3650KG Specifications

  • Type
    Parameter
  • -3db Bandwidth
    15 kHz
  • Supplier Device Package
    32-CDIP
  • Package / Case
    32-CDIP (0.900", 22.86mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    0°C ~ 85°C
  • Voltage - Supply Span (Max)
    36 V
  • Voltage - Supply Span (Min)
    16 V
  • Current - Output / Channel
    5 mA
  • Current - Supply
    2.3mA
  • Voltage - Input Offset
    500 µV
  • Current - Input Bias
    10 nA
  • Slew Rate
    1.2V/µs
  • Output Type
    -
  • Number of Circuits
    1
  • Amplifier Type
    Isolation
  • Packaging
    Tube
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The W77L532A25PL is a specific model of integrated circuit (IC) chip manufactured by Winbond Electronics Corporation. While specific advantages and application scenarios may vary depending on the requirements and use cases, here are some general advantages and potential application scenarios for the W77L532A25PL:Advantages: 1. Low Power Consumption: The W77L532A25PL is designed to operate with low power consumption, making it suitable for battery-powered devices or applications where power efficiency is crucial. 2. High Integration: This IC chip integrates various components and functionalities into a single package, reducing the need for external components and simplifying the overall design. 3. Cost-Effective: The integration of multiple functions and components into a single chip can help reduce the overall system cost, making it an attractive option for cost-sensitive applications. 4. Small Form Factor: The compact size of the chip allows for space-saving designs, making it suitable for applications with limited physical space.Application Scenarios: 1. Internet of Things (IoT) Devices: The low power consumption and high integration of the W77L532A25PL make it suitable for IoT devices that require connectivity, sensor interfaces, and low power operation. 2. Wearable Devices: The small form factor and low power consumption make the chip suitable for wearable devices such as smartwatches, fitness trackers, or health monitoring devices. 3. Home Automation: The chip can be used in home automation systems to control and monitor various devices, such as smart lighting, temperature control, or security systems. 4. Industrial Control Systems: The high integration and low power consumption make the chip suitable for industrial control systems, such as process automation, monitoring, or data acquisition. 5. Consumer Electronics: The chip can be used in various consumer electronics applications, including remote controls, gaming devices, or multimedia devices.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and capabilities of the W77L532A25PL chip, and it is always recommended to refer to the manufacturer's documentation and specifications for detailed information.
3650KG Relevant information