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3650HG

3650HG

Manufacturer No:

3650HG

Manufacturer:

Texas Instruments

Description:

IC OPAMP ISOLATION 1 CIRC 32CDIP

Datasheet:

Datasheet

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3650HG Specifications

  • Type
    Parameter
  • -3db Bandwidth
    15 kHz
  • Supplier Device Package
    32-CDIP
  • Package / Case
    32-CDIP (0.900", 22.86mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    0°C ~ 85°C
  • Voltage - Supply Span (Max)
    36 V
  • Voltage - Supply Span (Min)
    16 V
  • Current - Output / Channel
    5 mA
  • Current - Supply
    2.3mA
  • Voltage - Input Offset
    5 mV
  • Current - Input Bias
    10 nA
  • Slew Rate
    1.2V/µs
  • Output Type
    -
  • Number of Circuits
    1
  • Amplifier Type
    Isolation
  • Packaging
    Tube
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The PIC32MZ1025DAR169-V/6J is a high-performance microcontroller chip manufactured by Microchip Technology. It offers several advantages and can be applied in various scenarios. Here are some of its key advantages and application scenarios:Advantages: 1. High Performance: The PIC32MZ1025DAR169-V/6J is built on the MIPS32 microAptiv core, which provides a high level of performance and efficiency. It operates at a maximum frequency of 200 MHz and offers a wide range of peripherals and features.2. Large Memory Capacity: This chip has a large memory capacity, including 512 KB of Flash memory for program storage and 512 KB of RAM for data storage. This allows for the execution of complex applications and the storage of large amounts of data.3. Rich Peripherals: The PIC32MZ1025DAR169-V/6J offers a wide range of peripherals, including multiple UART, SPI, I2C, and USB interfaces. It also has advanced features like DMA (Direct Memory Access) and hardware encryption/decryption modules, which enhance its capabilities.4. Connectivity Options: The chip supports various communication protocols, including Ethernet, CAN, and USB. This makes it suitable for applications requiring network connectivity or communication with other devices.5. Low Power Consumption: Despite its high performance, the PIC32MZ1025DAR169-V/6J is designed to be power-efficient. It offers multiple low-power modes and features, allowing for energy-saving operation in battery-powered or low-power applications.Application Scenarios: 1. Embedded Systems: The PIC32MZ1025DAR169-V/6J is commonly used in embedded systems, such as industrial automation, home automation, and consumer electronics. Its high performance and rich peripherals make it suitable for controlling and interfacing with various devices and sensors.2. Internet of Things (IoT): With its connectivity options and low-power features, the chip can be used in IoT applications. It can serve as a central processing unit for IoT devices, enabling data processing, communication, and connectivity with cloud services.3. Motor Control: The high-performance capabilities of the PIC32MZ1025DAR169-V/6J make it suitable for motor control applications. It can be used to control and drive motors in robotics, industrial machinery, and automotive systems.4. Audio/Video Processing: The chip's processing power and memory capacity make it suitable for audio and video processing applications. It can be used in multimedia devices, audio/video streaming, and digital signal processing.5. Security Systems: The hardware encryption/decryption modules and connectivity options of the chip make it suitable for security systems. It can be used in access control systems, surveillance systems, and encryption/decryption applications.Overall, the PIC32MZ1025DAR169-V/6J offers high performance, rich peripherals, and connectivity options, making it suitable for a wide range of applications requiring processing power, memory capacity, and connectivity.
3650HG Relevant information