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LMC6682BIN

LMC6682BIN

Manufacturer No:

LMC6682BIN

Manufacturer:

Texas Instruments

Description:

IC CMOS 2 CIRCUIT 14DIP

Datasheet:

Datasheet

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LMC6682BIN Specifications

  • Type
    Parameter
  • -3db Bandwidth
    -
  • Supplier Device Package
    14-PDIP
  • Package / Case
    14-DIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply Span (Max)
    10 V
  • Voltage - Supply Span (Min)
    1.8 V
  • Current - Output / Channel
    70 mA
  • Current - Supply
    1.6mA (x2 Channels)
  • Voltage - Input Offset
    5 mV
  • Current - Input Bias
    2 µA
  • Gain Bandwidth Product
    1.2 MHz
  • Slew Rate
    1.2V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    2
  • Amplifier Type
    CMOS
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    LMC®
The LMC6682BIN is a high-speed, low-power dual operational amplifier integrated circuit chip. Some of its advantages and application scenarios include:1. High-speed operation: The LMC6682BIN is designed for high-speed applications, with a slew rate of 10V/μs and a bandwidth of 10MHz. This makes it suitable for applications that require fast signal processing and amplification.2. Low power consumption: The chip operates at a low supply voltage range of 2.7V to 12V and consumes very low quiescent current, making it ideal for battery-powered devices and other low-power applications.3. Rail-to-rail input and output: The LMC6682BIN supports rail-to-rail input and output voltage ranges, allowing it to handle signals that swing close to the supply rails. This feature is useful in applications where the input and output signals have a wide dynamic range.4. Wide temperature range: The chip is designed to operate over a wide temperature range, from -40°C to 85°C, making it suitable for use in various environmental conditions.5. Small package size: The LMC6682BIN is available in a small outline package (SOIC-8), which makes it easy to integrate into compact circuit designs.Application scenarios for the LMC6682BIN include:1. Signal conditioning: The chip can be used for amplifying and conditioning signals in various applications, such as sensor interfaces, data acquisition systems, and instrumentation.2. Active filters: The high-speed and low-power characteristics of the LMC6682BIN make it suitable for implementing active filters in audio and communication systems.3. Voltage-controlled oscillators (VCOs): The chip can be used in VCO circuits for generating frequency-modulated signals in applications like frequency synthesizers and phase-locked loops.4. Portable devices: Due to its low power consumption and small package size, the LMC6682BIN is well-suited for use in portable devices like smartphones, tablets, and wearable electronics.5. Industrial automation: The chip can be used in industrial automation systems for signal amplification, filtering, and control applications.Overall, the LMC6682BIN offers high-speed, low-power operation, rail-to-rail input/output capability, and a small package size, making it versatile for a wide range of applications that require precision amplification and signal conditioning.
LMC6682BIN Relevant information