Home / Instrumentation, OP Amps, Buffer Amps / MAX4253EBC+GC1/
MAX4253EBC+GC1

MAX4253EBC+GC1

Manufacturer No:

MAX4253EBC+GC1

Description:

IC OPAMP GP 2 CIRCUIT 12UCSP

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

MAX4253EBC+GC1 Specifications

  • Type
    Parameter
  • -3db Bandwidth
    -
  • Supplier Device Package
    10-UCSP
  • Package / Case
    10-WFBGA, CSPBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply Span (Max)
    5.5 V
  • Voltage - Supply Span (Min)
    2.4 V
  • Current - Output / Channel
    68 mA
  • Current - Supply
    420µA (x2 Channels)
  • Voltage - Input Offset
    70 µV
  • Current - Input Bias
    0.1 pA
  • Gain Bandwidth Product
    3 MHz
  • Slew Rate
    0.3V/µs
  • Output Type
    Push-Pull, Rail-to-Rail
  • Number of Circuits
    2
  • Amplifier Type
    General Purpose
  • Packaging
    Bulk
  • Product Status
    Obsolete
  • Series
    -
The MAX4253EBC+GC1 is a high-speed, low-power operational amplifier integrated circuit chip. It offers several advantages and can be applied in various scenarios. Here are some of its advantages and application scenarios:Advantages: 1. High Speed: The MAX4253EBC+GC1 is designed for high-speed applications, with a bandwidth of 200MHz. It can handle fast signal processing requirements.2. Low Power Consumption: This chip operates at low power, making it suitable for battery-powered devices or applications where power efficiency is crucial.3. Low Input Bias Current: The MAX4253EBC+GC1 has a low input bias current, which minimizes the impact of input current on the circuit's performance. This is particularly useful in applications where high-impedance sources are used.4. Rail-to-Rail Output: The chip provides rail-to-rail output swing, allowing it to drive signals close to the power supply rails. This feature is beneficial in applications where the full dynamic range of the power supply is required.5. Small Package: The MAX4253EBC+GC1 is available in a small package, making it suitable for space-constrained applications or designs where multiple amplifiers need to be integrated.Application Scenarios: 1. High-Frequency Signal Amplification: The high bandwidth of the MAX4253EBC+GC1 makes it suitable for amplifying high-frequency signals, such as in RF communication systems or high-speed data acquisition.2. Sensor Signal Conditioning: The low input bias current and rail-to-rail output swing make this chip ideal for sensor signal conditioning applications. It can amplify and process signals from various sensors, such as temperature sensors, pressure sensors, or strain gauges.3. Active Filters: The high-speed and low-power characteristics of the MAX4253EBC+GC1 make it suitable for active filter designs. It can be used in applications where precise filtering of signals is required, such as in audio systems or instrumentation.4. Portable Devices: The low power consumption and small package size make this chip suitable for portable devices like smartphones, tablets, or wearable devices. It can be used in audio amplification, signal conditioning, or other low-power applications in these devices.5. Test and Measurement Equipment: The high-speed capabilities of the MAX4253EBC+GC1 make it suitable for use in test and measurement equipment, such as oscilloscopes or signal generators. It can handle high-frequency signals and provide accurate amplification or signal conditioning.These are just a few examples of the advantages and application scenarios of the MAX4253EBC+GC1 integrated circuit chip. Its high speed, low power consumption, and small package size make it versatile for various applications requiring precision amplification and signal conditioning.
MAX4253EBC+GC1 Relevant information