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MCP6074T-E/STVAO

MCP6074T-E/STVAO

Manufacturer No:

MCP6074T-E/STVAO

Manufacturer:

Microchip Technology

Description:

IC OPAMP GP 4 CIRCUIT 14TSSOP

Datasheet:

Datasheet

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MCP6074T-E/STVAO Specifications

  • Type
    Parameter
  • -3db Bandwidth
    -
  • Supplier Device Package
    14-TSSOP
  • Package / Case
    14-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - Supply Span (Max)
    6 V
  • Voltage - Supply Span (Min)
    1.8 V
  • Current - Output / Channel
    28 mA
  • Current - Supply
    110µA (x4 Channels)
  • Voltage - Input Offset
    150 µV
  • Current - Input Bias
    1 pA
  • Gain Bandwidth Product
    1.2 MHz
  • Slew Rate
    0.5V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    4
  • Amplifier Type
    General Purpose
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    Automotive, AEC-Q100
The MCP6074T-E/STVAO is a low-power, low-offset voltage operational amplifier integrated circuit chip. It offers several advantages and can be applied in various scenarios. Here are some of the advantages and application scenarios of the MCP6074T-E/STVAO:Advantages: 1. Low power consumption: The MCP6074T-E/STVAO operates at a very low supply current, making it suitable for battery-powered applications or any scenario where power efficiency is crucial. 2. Low offset voltage: The chip has a low input offset voltage, which ensures accurate and precise amplification of signals. 3. Rail-to-rail input and output: The MCP6074T-E/STVAO supports rail-to-rail input and output operation, allowing it to handle signals that span the entire supply voltage range. 4. Wide bandwidth: The chip has a wide bandwidth, enabling it to amplify high-frequency signals accurately. 5. Small package size: The MCP6074T-E/STVAO is available in a small package, making it suitable for space-constrained applications.Application Scenarios: 1. Sensor amplification: The low offset voltage and wide bandwidth of the MCP6074T-E/STVAO make it suitable for amplifying signals from various sensors, such as temperature sensors, pressure sensors, or light sensors. 2. Portable devices: Due to its low power consumption, the chip can be used in portable devices like smartphones, tablets, or wearable devices, where power efficiency is crucial. 3. Audio amplification: The rail-to-rail input and output capability of the MCP6074T-E/STVAO make it suitable for audio amplification applications, such as headphone amplifiers or audio signal conditioning circuits. 4. Industrial automation: The chip's small package size and low power consumption make it suitable for industrial automation applications, such as control systems, data acquisition, or signal conditioning in industrial environments. 5. Medical devices: The low power consumption and accurate amplification capabilities of the MCP6074T-E/STVAO make it suitable for medical devices, such as patient monitoring systems or portable medical instruments.These are just a few examples of the advantages and application scenarios of the MCP6074T-E/STVAO integrated circuit chip. The chip's features make it versatile and applicable in various low-power, precision amplification applications.
MCP6074T-E/STVAO Relevant information