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MCP6294-E/STVAO

MCP6294-E/STVAO

Manufacturer No:

MCP6294-E/STVAO

Manufacturer:

Microchip Technology

Description:

IC OPAMP GP 4 CIRCUIT 14TSSOP

Datasheet:

Datasheet

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MCP6294-E/STVAO Specifications

  • Type
    Parameter
  • Supplier Device Package
    14-TSSOP
  • Package / Case
    14-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - Supply Span (Max)
    6 V
  • Voltage - Supply Span (Min)
    2.4 V
  • Current - Output / Channel
    25 mA
  • Current - Supply
    1mA (x4 Channels)
  • Voltage - Input Offset
    3 mV
  • Current - Input Bias
    1 pA
  • -3db Bandwidth
    -
  • Gain Bandwidth Product
    10 MHz
  • Slew Rate
    7V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    4
  • Amplifier Type
    General Purpose
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The MCP6294-E/STVAO is a low-power, rail-to-rail input/output operational amplifier (op-amp) integrated circuit chip. It offers several advantages and can be applied in various scenarios. Here are some of its advantages and application scenarios:Advantages: 1. Low power consumption: The MCP6294-E/STVAO is designed to operate at low power, making it suitable for battery-powered applications or any scenario where power efficiency is crucial. 2. Rail-to-rail input/output: This op-amp chip supports rail-to-rail input and output voltage ranges, allowing it to handle signals that span the entire supply voltage range. This feature ensures accurate signal amplification and processing. 3. Wide bandwidth: With a wide bandwidth, the MCP6294-E/STVAO can handle high-frequency signals without significant distortion, making it suitable for applications that require amplification of fast-changing signals. 4. Low input offset voltage and low input bias current: These characteristics ensure accurate and precise signal amplification, making the chip suitable for applications that require high precision, such as sensor interfaces or measurement circuits. 5. Small package size: The MCP6294-E/STVAO is available in a small package, making it suitable for space-constrained applications or designs where multiple op-amps need to be integrated into a compact circuit board.Application scenarios: 1. Sensor interfaces: The low input offset voltage and low input bias current of the MCP6294-E/STVAO make it suitable for amplifying and conditioning signals from various sensors, such as temperature sensors, pressure sensors, or light sensors. 2. Portable devices: The low power consumption and small package size make the chip ideal for portable devices like smartphones, tablets, or wearable devices, where power efficiency and space-saving are critical. 3. Audio amplification: The rail-to-rail input/output capability and wide bandwidth of the MCP6294-E/STVAO make it suitable for audio amplification applications, such as headphone amplifiers or audio signal processing circuits. 4. Industrial automation: The chip's precision and low power consumption make it suitable for industrial automation applications, such as control systems, motor control, or data acquisition systems. 5. Medical devices: The low power consumption and small package size make the chip suitable for medical devices, such as patient monitoring systems, portable medical instruments, or implantable devices.These are just a few examples of the advantages and application scenarios of the MCP6294-E/STVAO integrated circuit chip. Its versatility, low power consumption, and precision make it suitable for a wide range of applications where accurate signal amplification and processing are required.
MCP6294-E/STVAO Relevant information