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TLV2772CP

TLV2772CP

Manufacturer No:

TLV2772CP

Manufacturer:

Texas Instruments

Description:

IC CMOS 2 CIRCUIT 8DIP

Datasheet:

Datasheet

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TLV2772CP Specifications

  • Type
    Parameter
  • -3db Bandwidth
    -
  • Supplier Device Package
    8-PDIP
  • Package / Case
    8-DIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Voltage - Supply Span (Max)
    5.5 V
  • Voltage - Supply Span (Min)
    2.5 V
  • Current - Output / Channel
    50 mA
  • Current - Supply
    1mA (x2 Channels)
  • Voltage - Input Offset
    500 µV
  • Current - Input Bias
    2 pA
  • Gain Bandwidth Product
    5.1 MHz
  • Slew Rate
    10.5V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    2
  • Amplifier Type
    CMOS
  • Packaging
    Tube
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The TLV2772CP is a dual operational amplifier integrated circuit chip manufactured by Texas Instruments. It offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the TLV2772CP are:Advantages: 1. Low noise: The TLV2772CP has a low noise voltage of 8 nV/√Hz, which makes it suitable for applications requiring high precision and low noise amplification. 2. Low power consumption: It operates at a low supply current of 550 μA per channel, making it suitable for battery-powered applications or low-power designs. 3. Rail-to-rail input and output: The chip supports rail-to-rail input and output voltage range, allowing it to handle signals close to the supply rails, maximizing dynamic range and minimizing distortion. 4. Wide bandwidth: With a gain bandwidth product of 10 MHz, the TLV2772CP can handle high-frequency signals and is suitable for applications requiring wide bandwidth amplification.Application Scenarios: 1. Audio amplification: The TLV2772CP's low noise and wide bandwidth make it suitable for audio amplification applications, such as headphone amplifiers, audio mixers, or preamplifiers. 2. Sensor signal conditioning: The low noise and rail-to-rail input/output capabilities of the chip make it suitable for amplifying and conditioning signals from various sensors, such as temperature sensors, pressure sensors, or strain gauges. 3. Portable devices: Due to its low power consumption, the TLV2772CP is well-suited for portable devices like smartphones, tablets, or portable medical devices, where power efficiency is crucial. 4. Signal processing: The chip's wide bandwidth and rail-to-rail capabilities make it suitable for signal processing applications, such as active filters, data acquisition systems, or waveform generators.It is important to note that the TLV2772CP's specific advantages and application scenarios may vary depending on the requirements of the particular design or project.
TLV2772CP Relevant information