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TLV172IDCKT

TLV172IDCKT

Manufacturer No:

TLV172IDCKT

Manufacturer:

Texas Instruments

Description:

IC OPAMP GP 1 CIRCUIT SC70-5

Datasheet:

Datasheet

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TLV172IDCKT Specifications

  • Type
    Parameter
  • -3db Bandwidth
    -
  • Supplier Device Package
    SC-70-5
  • Package / Case
    5-TSSOP, SC-70-5, SOT-353
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Voltage - Supply Span (Max)
    36 V
  • Voltage - Supply Span (Min)
    4.5 V
  • Current - Output / Channel
    75 mA
  • Current - Supply
    1.6mA
  • Voltage - Input Offset
    500 µV
  • Current - Input Bias
    10 pA
  • Gain Bandwidth Product
    10 MHz
  • Slew Rate
    10V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    1
  • Amplifier Type
    General Purpose
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The TLV172IDCKT is a precision operational amplifier integrated circuit chip manufactured by Texas Instruments. It offers several advantages and can be applied in various scenarios. Here are some of its advantages and application scenarios:Advantages: 1. High precision: The TLV172IDCKT provides excellent precision with low offset voltage, low input bias current, and low input offset voltage drift. This makes it suitable for applications that require accurate signal amplification and measurement.2. Low noise: It has low noise characteristics, which makes it suitable for applications that require amplification of low-level signals without introducing significant noise.3. Wide bandwidth: The TLV172IDCKT has a wide bandwidth, enabling it to handle high-frequency signals accurately. This makes it suitable for applications such as audio amplification, data acquisition, and sensor signal conditioning.4. Low power consumption: It operates at low power supply voltages and consumes minimal power, making it suitable for battery-powered applications or devices with power constraints.5. Rail-to-rail input and output: The chip supports rail-to-rail input and output voltage range, allowing it to handle signals close to the power supply rails. This feature is beneficial in applications where the input or output signals can swing to the power supply voltage levels.Application scenarios: 1. Sensor signal conditioning: The TLV172IDCKT can be used to amplify and condition signals from various sensors such as temperature sensors, pressure sensors, and strain gauges. Its precision and low noise characteristics ensure accurate measurement and conditioning of sensor signals.2. Audio amplification: The chip's wide bandwidth and low distortion make it suitable for audio amplification applications. It can be used in audio equipment, portable audio devices, and audio signal processing circuits.3. Data acquisition systems: The TLV172IDCKT can be used in data acquisition systems to amplify and condition analog signals before digitization. Its precision and low noise characteristics ensure accurate and reliable data acquisition.4. Instrumentation and measurement: The chip's high precision and low noise make it suitable for instrumentation and measurement applications. It can be used in multimeters, oscilloscopes, and other measurement equipment to amplify and condition signals for accurate measurements.5. Portable and battery-powered devices: The TLV172IDCKT's low power consumption and rail-to-rail input/output capabilities make it suitable for portable and battery-powered devices. It can be used in handheld devices, medical instruments, and other portable applications where power efficiency and signal range are important.Overall, the TLV172IDCKT integrated circuit chip offers high precision, low noise, wide bandwidth, and low power consumption, making it suitable for various applications requiring accurate signal amplification and conditioning.
TLV172IDCKT Relevant information