TSV852IQ2T

TSV852IQ2T

Manufacturer No:

TSV852IQ2T

Manufacturer:

STMicroelectronics

Description:

IC OPAMP GP 2 CIRCUIT 8DFN

Datasheet:

Datasheet

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TSV852IQ2T Specifications

  • Type
    Parameter
  • -3db Bandwidth
    -
  • Supplier Device Package
    8-DFN (2x2)
  • Package / Case
    8-UFDFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Voltage - Supply Span (Max)
    5.5 V
  • Voltage - Supply Span (Min)
    2.5 V
  • Current - Output / Channel
    70 mA
  • Current - Supply
    130µA (x2 Channels)
  • Voltage - Input Offset
    4 mV
  • Current - Input Bias
    27 nA
  • Gain Bandwidth Product
    1.3 MHz
  • Slew Rate
    0.7V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    2
  • Amplifier Type
    General Purpose
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    Automotive, AEC-Q100
The TSV852IQ2T is an integrated circuit (IC) chip manufactured by Texas Instruments. It is a dual operational amplifier with rail-to-rail input and output capabilities. Here are some advantages and application scenarios of the TSV852IQ2T IC chip:Advantages: 1. Rail-to-rail input and output: The chip supports input and output voltage ranges that cover the entire supply voltage range, allowing for maximum utilization of the available voltage range. 2. Low power consumption: The TSV852IQ2T operates at low power, making it suitable for battery-powered devices and applications where power efficiency is crucial. 3. High precision and accuracy: The chip offers high precision and accuracy in amplification, making it suitable for applications that require precise signal conditioning and amplification. 4. Wide supply voltage range: The chip can operate with a wide range of supply voltages, providing flexibility in various applications. 5. Small form factor: The TSV852IQ2T is available in small packages, making it suitable for space-constrained applications.Application scenarios: 1. Portable devices: The low power consumption and small form factor of the TSV852IQ2T make it suitable for use in portable devices such as smartphones, tablets, and wearable devices. 2. Sensor interfaces: The high precision and accuracy of the chip make it suitable for sensor interface applications, where amplification and conditioning of sensor signals are required. 3. Audio amplification: The rail-to-rail input and output capabilities of the chip make it suitable for audio amplification applications, such as headphone amplifiers and audio signal conditioning circuits. 4. Industrial automation: The TSV852IQ2T can be used in industrial automation applications that require precise signal conditioning and amplification, such as process control systems and instrumentation. 5. Medical devices: The chip's low power consumption and small form factor make it suitable for medical devices that require battery-powered operation and compact design, such as portable medical monitors and diagnostic equipment.It is important to note that the specific application scenarios may vary depending on the requirements and design considerations of the target system.