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TLV2376IDGKR

TLV2376IDGKR

Manufacturer No:

TLV2376IDGKR

Manufacturer:

Texas Instruments

Description:

IC CMOS 2 CIRCUIT 8VSSOP

Datasheet:

Datasheet

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TLV2376IDGKR Specifications

  • Type
    Parameter
  • -3db Bandwidth
    -
  • Supplier Device Package
    8-VSSOP
  • Package / Case
    8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Voltage - Supply Span (Max)
    5.5 V
  • Voltage - Supply Span (Min)
    2.2 V
  • Current - Output / Channel
    30 mA
  • Current - Supply
    815µA (x2 Channels)
  • Voltage - Input Offset
    40 µV
  • Current - Input Bias
    0.3 pA
  • Gain Bandwidth Product
    5.5 MHz
  • Slew Rate
    2V/µs
  • Output Type
    Differential, Rail-to-Rail
  • Number of Circuits
    2
  • Amplifier Type
    CMOS
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The TLV2376IDGKR is a precision operational amplifier integrated circuit chip manufactured by Texas Instruments. It offers several advantages and can be used in various application scenarios. Here are some of its key advantages and application scenarios:Advantages: 1. Precision: The TLV2376IDGKR is a precision amplifier, providing high accuracy and low offset voltage, which makes it suitable for applications requiring precise signal amplification. 2. Low Power Consumption: This chip has low power consumption, making it ideal for battery-powered devices or applications where power efficiency is crucial. 3. Rail-to-Rail Input and Output: The TLV2376IDGKR supports rail-to-rail input and output operation, allowing it to handle signals that extend to the power supply rails. This feature is beneficial in applications where the input or output signals have a wide dynamic range. 4. Wide Bandwidth: With a wide bandwidth, this chip can handle high-frequency signals accurately, making it suitable for applications that require amplification of fast-changing signals. 5. Small Package: The TLV2376IDGKR comes in a small package, making it suitable for space-constrained applications or designs where multiple amplifiers need to be integrated into a compact form factor.Application Scenarios: 1. Sensor Signal Conditioning: The TLV2376IDGKR can be used to amplify and condition signals from various sensors, such as temperature sensors, pressure sensors, or strain gauges. Its precision and low offset voltage help maintain the accuracy of the sensor measurements. 2. Portable Devices: Due to its low power consumption and small package, this chip is suitable for portable devices like smartphones, tablets, or wearable devices, where power efficiency and space-saving are essential. 3. Audio Amplification: The TLV2376IDGKR can be used in audio amplification circuits, such as headphone amplifiers or audio preamplifiers, where accurate and low-distortion amplification of audio signals is required. 4. Industrial Control Systems: This chip can be used in industrial control systems, such as process control or automation, where precise amplification and conditioning of signals are necessary for accurate control and monitoring. 5. Test and Measurement Equipment: The TLV2376IDGKR can be utilized in test and measurement equipment, such as oscilloscopes or data acquisition systems, where accurate signal amplification and conditioning are crucial for precise measurements.These are just a few examples of the advantages and application scenarios of the TLV2376IDGKR integrated circuit chip. Its versatility and precision make it suitable for a wide range of applications where accurate signal amplification and conditioning are required.
TLV2376IDGKR Relevant information