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TLV316IDBVT

TLV316IDBVT

Manufacturer No:

TLV316IDBVT

Manufacturer:

Texas Instruments

Description:

IC OPAMP GP 1 CIRCUIT SOT23-5

Datasheet:

Datasheet

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TLV316IDBVT Specifications

  • Type
    Parameter
  • -3db Bandwidth
    -
  • Supplier Device Package
    SOT-23-5
  • Package / Case
    SC-74A, SOT-753
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Voltage - Supply Span (Max)
    5.5 V
  • Voltage - Supply Span (Min)
    1.8 V
  • Current - Supply
    400µA
  • Voltage - Input Offset
    750 µV
  • Current - Input Bias
    10 pA
  • Gain Bandwidth Product
    10 MHz
  • Slew Rate
    6V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    1
  • Amplifier Type
    General Purpose
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The TLV316IDBVT is a low-power, rail-to-rail input/output operational amplifier (op-amp) integrated circuit chip. Some of its advantages and application scenarios include:1. Low power consumption: The TLV316IDBVT is designed to operate with low power consumption, making it suitable for battery-powered devices and applications where power efficiency is crucial.2. Rail-to-rail input/output: This op-amp chip supports rail-to-rail input and output voltage ranges, allowing it to handle signals that span the entire supply voltage range. This feature is beneficial in applications where the input and output signals need to be accurately amplified or processed near the power supply rails.3. Wide supply voltage range: The TLV316IDBVT can operate with a wide supply voltage range, typically from 2.7V to 16V. This flexibility makes it compatible with various power supply configurations and voltage levels.4. High precision and accuracy: This op-amp chip offers high precision and accuracy in amplification and signal processing, making it suitable for applications that require precise measurements or signal conditioning.5. Small package size: The TLV316IDBVT is available in a small SOT-23 package, which is compact and space-saving. This feature is advantageous in applications with limited board space or where miniaturization is a requirement.Application scenarios for TLV316IDBVT integrated circuit chips include:1. Portable devices: Due to its low power consumption and small package size, the TLV316IDBVT is commonly used in portable devices such as smartphones, tablets, portable media players, and wearable devices.2. Sensor interfaces: The high precision and accuracy of the TLV316IDBVT make it suitable for sensor interface applications. It can amplify and condition signals from various sensors, including temperature sensors, pressure sensors, and light sensors.3. Battery management systems: The low power consumption and wide supply voltage range of the TLV316IDBVT make it ideal for battery management systems in applications like electric vehicles, solar power systems, and energy storage systems.4. Industrial automation: The TLV316IDBVT can be used in industrial automation applications, such as process control, instrumentation, and data acquisition systems, where accurate signal amplification and processing are required.5. Audio amplification: The rail-to-rail input/output capability of the TLV316IDBVT makes it suitable for audio amplification applications, including portable audio devices, headphones, and audio systems.Overall, the TLV316IDBVT integrated circuit chip offers low power consumption, rail-to-rail input/output, wide supply voltage range, high precision, and small package size, making it versatile for various applications requiring accurate signal amplification and processing.
TLV316IDBVT Relevant information