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BU7255HFV-TR

BU7255HFV-TR

Manufacturer No:

BU7255HFV-TR

Manufacturer:

Description:

IC OPAMP GP 1 CIRCUIT 5HVSOF

Datasheet:

Datasheet

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BU7255HFV-TR Specifications

  • Type
    Parameter
  • -3db Bandwidth
    -
  • Supplier Device Package
    5-HVSOF
  • Package / Case
    SOT-665
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply Span (Max)
    5.5 V
  • Voltage - Supply Span (Min)
    2.4 V
  • Current - Output / Channel
    8 mA
  • Current - Supply
    540µA
  • Voltage - Input Offset
    1 mV
  • Current - Input Bias
    1 pA
  • Gain Bandwidth Product
    4 MHz
  • Slew Rate
    3.4V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    1
  • Amplifier Type
    General Purpose
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The BU7255HFV-TR is a specific integrated circuit chip, and without more information about its specific features and functions, it is difficult to provide a comprehensive list of advantages and application scenarios. However, here are some general advantages and potential application scenarios for integrated circuit chips:Advantages of integrated circuit chips: 1. Miniaturization: Integrated circuit chips allow for the integration of multiple electronic components onto a single chip, leading to smaller and more compact designs. 2. Cost-effective: Mass production of integrated circuit chips reduces manufacturing costs, making them more affordable compared to discrete components. 3. Reliability: Integrated circuit chips are less prone to failure due to their compact design and reduced interconnection points. 4. Power efficiency: Integrated circuit chips can be designed to optimize power consumption, making them more energy-efficient. 5. Performance: Integrated circuit chips can offer high-speed operation, improved signal processing capabilities, and advanced features.Application scenarios for integrated circuit chips: 1. Consumer electronics: Integrated circuit chips are widely used in smartphones, tablets, laptops, televisions, and other consumer electronic devices. 2. Automotive industry: Integrated circuit chips are used in various automotive applications, including engine control units, infotainment systems, and advanced driver-assistance systems (ADAS). 3. Industrial automation: Integrated circuit chips are used in industrial control systems, robotics, and process automation. 4. Medical devices: Integrated circuit chips are used in medical equipment such as patient monitors, imaging systems, and implantable devices. 5. Internet of Things (IoT): Integrated circuit chips are essential for IoT devices, enabling connectivity, data processing, and sensor integration. 6. Communication systems: Integrated circuit chips are used in telecommunications, networking equipment, and wireless communication devices. 7. Aerospace and defense: Integrated circuit chips are used in avionics, satellite systems, radar systems, and military applications.It is important to note that the specific advantages and application scenarios of the BU7255HFV-TR chip may vary depending on its intended purpose and specifications.
BU7255HFV-TR Relevant information