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BA3472YFV-CE2

BA3472YFV-CE2

Manufacturer No:

BA3472YFV-CE2

Manufacturer:

Description:

IC OPAMP GP 2 CIRCUIT 8SSOPB

Datasheet:

Datasheet

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BA3472YFV-CE2 Specifications

  • Type
    Parameter
  • -3db Bandwidth
    -
  • Supplier Device Package
    8-SSOP-B
  • Package / Case
    8-LSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Voltage - Supply Span (Max)
    36 V
  • Voltage - Supply Span (Min)
    3 V
  • Current - Output / Channel
    30 mA
  • Current - Supply
    4mA
  • Voltage - Input Offset
    10 mV
  • Current - Input Bias
    100 nA
  • Gain Bandwidth Product
    4 MHz
  • Slew Rate
    10V/µs
  • Output Type
    -
  • Number of Circuits
    2
  • Amplifier Type
    General Purpose
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    Automotive, AEC-Q100
The BA3472YFV-CE2 integrated circuit chips have several advantages and application scenarios:Advantages: 1. Low power consumption: These chips are designed to operate with low power consumption, making them suitable for battery-powered devices or energy-efficient applications. 2. Small form factor: The chips are compact in size, allowing for easy integration into small electronic devices or systems with limited space. 3. High performance: They offer high-performance capabilities, enabling efficient signal processing and accurate data transmission. 4. Wide operating voltage range: The chips can operate within a wide voltage range, making them versatile and compatible with various power supply configurations. 5. Cost-effective: These chips are cost-effective, making them suitable for mass production and commercial applications.Application Scenarios: 1. Wireless communication systems: The BA3472YFV-CE2 chips can be used in wireless communication systems, such as Bluetooth or Wi-Fi modules, to enable efficient signal processing and data transmission. 2. Consumer electronics: They can be integrated into various consumer electronic devices like smartphones, tablets, or wearables, to enhance their performance and functionality. 3. Internet of Things (IoT): These chips can be used in IoT devices, such as smart home appliances, security systems, or industrial sensors, to enable wireless connectivity and efficient data processing. 4. Automotive electronics: The chips can be utilized in automotive applications, such as car infotainment systems, GPS navigation devices, or advanced driver-assistance systems (ADAS), to enhance their performance and connectivity. 5. Industrial automation: They can be employed in industrial automation systems, such as control panels, robotics, or machine-to-machine communication, to enable efficient data processing and communication.Overall, the BA3472YFV-CE2 integrated circuit chips offer low power consumption, small form factor, high performance, and cost-effectiveness, making them suitable for various wireless communication, consumer electronics, IoT, automotive, and industrial automation applications.
BA3472YFV-CE2 Relevant information