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TSV911IDT

TSV911IDT

Manufacturer No:

TSV911IDT

Manufacturer:

STMicroelectronics

Description:

IC OPAMP GP 1 CIRCUIT 8SOIC

Datasheet:

Datasheet

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TSV911IDT Specifications

  • Type
    Parameter
  • -3db Bandwidth
    -
  • Supplier Device Package
    8-SOIC
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Voltage - Supply Span (Max)
    5.5 V
  • Voltage - Supply Span (Min)
    2.5 V
  • Current - Output / Channel
    35 mA
  • Current - Supply
    820µA
  • Voltage - Input Offset
    100 µV
  • Current - Input Bias
    1 pA
  • Gain Bandwidth Product
    8 MHz
  • Slew Rate
    4.5V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    1
  • Amplifier Type
    General Purpose
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The TSV911IDT is an integrated circuit (IC) chip designed by STMicroelectronics. It is part of the TSV series of operational amplifiers (Op-Amps). The chip offers several advantages and can be applied in various scenarios:Advantages of TSV911IDT IC chips: 1. Low power consumption: The chip is designed for low power operation, making it suitable for battery-powered applications or any system with strict power constraints. 2. Rail-to-rail input and output range: The Op-Amp can accept and deliver signals that are close to the supply rails, enabling accurate amplification of input signals. 3. Low input offset voltage: The chip provides precise amplification with minimal input offset voltage, ensuring accurate signal representation. 4. High gain bandwidth: TSV911IDT has a high gain bandwidth, enabling it to amplify high-frequency signals accurately. 5. Wide supply voltage range: The IC chip operates on a wide supply voltage range, making it suitable for various power supply configurations and applications.Application scenarios for TSV911IDT IC chips: 1. Portable devices: The low power consumption and rail-to-rail input/output range make the chip suitable for portable devices like smartphones, tablets, digital cameras, and portable media players. 2. Sensor interfaces: The low input offset voltage and high gain bandwidth make the chip apt for amplifying and conditioning signals from various sensors, such as temperature sensors, accelerometers, pressure sensors, and more. 3. Audio applications: The rail-to-rail capabilities and wide supply voltage range make the chip useful for audio amplification in devices like headphones, speakers, and portable audio devices. 4. Signal conditioning: TSV911IDT can be used in signal conditioning circuits, such as in analog-to-digital converters (ADCs) or other systems requiring precise amplification and conditioning of signals. 5. Industrial and automotive electronics: The chip's robust performance, low power consumption, and wide supply voltage range make it suitable for industrial monitoring and control systems, automotive electronics, and other harsh environment applications.It's worth noting that while the mentioned advantages and scenarios are typical for the TSV911IDT chip, the specific application of any IC chip depends on the designer's requirements and system specifications.
TSV911IDT Relevant information