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TLV9102IDR

TLV9102IDR

Manufacturer No:

TLV9102IDR

Manufacturer:

Texas Instruments

Description:

IC OPAMP GP 2 CIRCUIT 8SOIC

Datasheet:

Datasheet

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TLV9102IDR Specifications

  • Type
    Parameter
  • -3db Bandwidth
    -
  • Supplier Device Package
    8-SOIC
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - Supply Span (Max)
    16 V
  • Voltage - Supply Span (Min)
    2.7 V
  • Current - Output / Channel
    80 mA
  • Current - Supply
    115µA (x2 Channels)
  • Voltage - Input Offset
    300 µV
  • Current - Input Bias
    10 pA
  • Gain Bandwidth Product
    1.1 MHz
  • Slew Rate
    4.5V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    2
  • Amplifier Type
    General Purpose
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The TLV9102IDR is a dual-channel, high-speed, low-power operational amplifier integrated circuit chip. It offers several advantages and can be used in various application scenarios. Some of the advantages and application scenarios of the TLV9102IDR are:Advantages: 1. High-speed operation: The TLV9102IDR is designed for high-speed applications, making it suitable for use in systems that require fast signal processing. 2. Low power consumption: It has a low quiescent current, which helps in reducing power consumption, making it ideal for battery-powered devices or applications where power efficiency is crucial. 3. Rail-to-rail input and output: The chip supports rail-to-rail input and output voltage range, allowing it to operate with signals that span the entire supply voltage range. 4. Wide supply voltage range: It can operate from a wide supply voltage range, typically from 1.8V to 5.5V, making it compatible with a variety of power sources. 5. Small package size: The TLV9102IDR is available in small package options, such as the 8-pin SOIC package, which makes it suitable for space-constrained applications.Application Scenarios: 1. Portable devices: The low power consumption and small package size of the TLV9102IDR make it suitable for use in portable devices like smartphones, tablets, and wearable devices, where power efficiency and compactness are essential. 2. Sensor interfaces: The high-speed operation and rail-to-rail input/output capabilities of the chip make it suitable for sensor interface applications, where accurate and fast signal amplification is required. 3. Audio amplification: The TLV9102IDR can be used in audio amplification circuits, such as headphone amplifiers or audio line drivers, where high-speed operation and low power consumption are desired. 4. Communication systems: It can be used in communication systems, such as data transmission or reception circuits, where high-speed signal processing is crucial. 5. Industrial automation: The chip can be utilized in industrial automation applications, such as motor control or signal conditioning circuits, where high-speed and low-power operation is required.These are just a few examples of the advantages and application scenarios of the TLV9102IDR integrated circuit chip. Its versatility, high-speed operation, low power consumption, and small package size make it suitable for a wide range of applications in various industries.
TLV9102IDR Relevant information