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TSV912AQDRQ1

TSV912AQDRQ1

Manufacturer No:

TSV912AQDRQ1

Manufacturer:

Texas Instruments

Description:

IC OPAMP GP 2 CIRCUIT 8SOIC

Datasheet:

Datasheet

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TSV912AQDRQ1 Specifications

  • Type
    Parameter
  • -3db Bandwidth
    -
  • Supplier Device Package
    8-SOIC
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Voltage - Supply Span (Max)
    5.5 V
  • Voltage - Supply Span (Min)
    2.5 V
  • Current - Output / Channel
    50 mA
  • Current - Supply
    550µA (x2 Channels)
  • Voltage - Input Offset
    300 µV
  • Current - Input Bias
    5 pA
  • Gain Bandwidth Product
    8 MHz
  • Slew Rate
    4.5V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    2
  • Amplifier Type
    General Purpose
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    Automotive, AEC-Q100
The TSV912AQDRQ1 is a specific model of integrated circuit (IC) chip manufactured by Texas Instruments. It is a low-power, rail-to-rail input/output operational amplifier. Some of the advantages and application scenarios of the TSV912AQDRQ1 IC chips are as follows:Advantages: 1. Low power consumption: The TSV912AQDRQ1 is designed to operate with low power consumption, making it suitable for battery-powered devices or applications where power efficiency is crucial. 2. Rail-to-rail input/output: The chip supports rail-to-rail input and output voltage range, allowing it to handle signals close to the power supply rails. This feature enhances the dynamic range and accuracy of the amplifier. 3. Wide supply voltage range: The TSV912AQDRQ1 can operate with a wide supply voltage range, typically from 1.8V to 5.5V. This flexibility makes it compatible with various power supply configurations. 4. Small package size: The chip is available in a small package size, such as the 8-pin SOIC (Small Outline Integrated Circuit) package, which makes it suitable for space-constrained applications.Application scenarios: 1. Portable devices: The low power consumption and small package size of the TSV912AQDRQ1 make it suitable for portable devices like smartphones, tablets, portable media players, and wearable devices. 2. Sensor interfaces: The rail-to-rail input/output capability of the chip makes it suitable for sensor interface applications. It can accurately amplify and process signals from various sensors like temperature sensors, pressure sensors, light sensors, etc. 3. Battery-powered systems: The low power consumption of the chip makes it ideal for battery-powered systems, such as wireless sensor networks, remote monitoring systems, and IoT (Internet of Things) devices. 4. Industrial automation: The TSV912AQDRQ1 can be used in industrial automation applications where low power consumption, small size, and wide supply voltage range are required. It can be used for signal conditioning, amplification, and control in various industrial sensors and actuators.It is important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the target system or application.
TSV912AQDRQ1 Relevant information