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LMV602MAX/NOPB

LMV602MAX/NOPB

Manufacturer No:

LMV602MAX/NOPB

Manufacturer:

Texas Instruments

Description:

IC OPAMP GP 2 CIRCUIT 8SOIC

Datasheet:

Datasheet

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LMV602MAX/NOPB Specifications

  • Type
    Parameter
  • -3db Bandwidth
    -
  • Supplier Device Package
    8-SOIC
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Voltage - Supply Span (Max)
    5.5 V
  • Voltage - Supply Span (Min)
    2.7 V
  • Current - Output / Channel
    113 mA
  • Current - Supply
    100µA (x2 Channels)
  • Voltage - Input Offset
    550 µV
  • Current - Input Bias
    0.02 pA
  • Gain Bandwidth Product
    1 MHz
  • Slew Rate
    1V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    2
  • Amplifier Type
    General Purpose
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    LMV®
The LMV602MAX/NOPB is a low-power, low-voltage operational amplifier integrated circuit chip. Some of its advantages and application scenarios include:1. Low power consumption: The LMV602MAX/NOPB is designed to operate at low power levels, making it suitable for battery-powered devices and applications where power efficiency is crucial.2. Low voltage operation: This chip can operate at low supply voltages, typically ranging from 2.7V to 5.5V. It is ideal for applications that require low voltage operation, such as portable electronics and low-power sensor circuits.3. Rail-to-rail input and output: The LMV602MAX/NOPB supports rail-to-rail input and output voltage ranges. This means that it can handle signals that swing close to the supply voltage rails, allowing for maximum utilization of the available voltage range.4. Wide bandwidth and fast settling time: This operational amplifier chip offers a wide bandwidth and fast settling time, making it suitable for applications that require high-speed signal processing, such as audio amplification, data acquisition, and communication systems.5. Small package size: The LMV602MAX/NOPB is available in a small package size, such as the 8-pin SOIC (Small Outline Integrated Circuit) package. This compact form factor makes it suitable for space-constrained applications, including portable devices and miniaturized circuits.6. General-purpose applications: The LMV602MAX/NOPB can be used in a wide range of general-purpose applications, including audio amplifiers, active filters, instrumentation amplifiers, voltage references, and sensor signal conditioning circuits.Overall, the LMV602MAX/NOPB integrated circuit chip offers low power consumption, low voltage operation, rail-to-rail input/output, wide bandwidth, fast settling time, small package size, and versatility for various general-purpose applications.
LMV602MAX/NOPB Relevant information