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TLV316IDBVR

TLV316IDBVR

Manufacturer No:

TLV316IDBVR

Manufacturer:

Texas Instruments

Description:

IC OPAMP GP 1 CIRCUIT SOT23-5

Datasheet:

Datasheet

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TLV316IDBVR Specifications

  • Type
    Parameter
  • -3db Bandwidth
    -
  • Supplier Device Package
    SOT-23-5
  • Package / Case
    SC-74A, SOT-753
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Voltage - Supply Span (Max)
    5.5 V
  • Voltage - Supply Span (Min)
    1.8 V
  • Current - Supply
    400µA
  • Voltage - Input Offset
    750 µV
  • Current - Input Bias
    10 pA
  • Gain Bandwidth Product
    10 MHz
  • Slew Rate
    6V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    1
  • Amplifier Type
    General Purpose
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The TLV316IDBVR is a low-power, precision operational amplifier integrated circuit chip manufactured by Texas Instruments. It offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the TLV316IDBVR are:Advantages: 1. Low Power Consumption: The TLV316IDBVR operates at a low supply current of 550μA per channel, making it suitable for battery-powered applications or any scenario where power efficiency is crucial. 2. Precision Performance: It provides excellent precision with a maximum offset voltage of 500μV, low input bias current of 1pA, and low input offset voltage drift of 0.5μV/°C. This precision makes it suitable for applications requiring accurate signal amplification or measurement. 3. Rail-to-Rail Input and Output: The chip supports rail-to-rail input and output operation, allowing it to handle signals close to the supply voltage rails. This feature is beneficial in applications where the input or output signals have a wide dynamic range. 4. Wide Supply Voltage Range: The TLV316IDBVR can operate from a supply voltage as low as 2.7V to as high as 16V, providing flexibility in various power supply scenarios.Application Scenarios: 1. Sensor Signal Conditioning: The TLV316IDBVR's precision and low power consumption make it suitable for amplifying and conditioning signals from various sensors, such as temperature sensors, pressure sensors, or strain gauges. 2. Portable and Battery-Powered Devices: Due to its low power consumption, the chip can be used in portable devices like smartphones, tablets, or wearable devices, where power efficiency is crucial for extended battery life. 3. Audio Amplification: The rail-to-rail input and output capability of the TLV316IDBVR make it suitable for audio amplification applications, such as headphone amplifiers or portable audio devices. 4. Industrial Control Systems: The precision and wide supply voltage range of the chip make it suitable for industrial control systems, where accurate signal amplification and measurement are required across a wide range of operating conditions. 5. Medical Devices: The TLV316IDBVR can be used in medical devices that require precision amplification of signals, such as ECG monitors, blood glucose meters, or patient monitoring systems.These are just a few examples of the advantages and application scenarios of the TLV316IDBVR integrated circuit chip. Its versatility, precision, and low power consumption make it suitable for a wide range of applications in various industries.
TLV316IDBVR Relevant information