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TLV9002QDGKRQ1

TLV9002QDGKRQ1

Manufacturer No:

TLV9002QDGKRQ1

Manufacturer:

Texas Instruments

Description:

IC OPAMP GP 2 CIRCUIT 8VSSOP

Datasheet:

Datasheet

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TLV9002QDGKRQ1 Specifications

  • Type
    Parameter
  • -3db Bandwidth
    -
  • Supplier Device Package
    8-VSSOP
  • Package / Case
    8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - Supply Span (Max)
    5.5 V
  • Voltage - Supply Span (Min)
    1.8 V
  • Current - Output / Channel
    40 mA
  • Current - Supply
    60µA (x4 Channels)
  • Voltage - Input Offset
    400 µV
  • Current - Input Bias
    5 pA
  • Gain Bandwidth Product
    1 MHz
  • Slew Rate
    2V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    2
  • Amplifier Type
    General Purpose
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    Automotive, AEC-Q100
The TLV9002QDGKRQ1 is a dual operational amplifier integrated circuit chip manufactured by Texas Instruments. It is specifically designed for automotive applications, offering several advantages and application scenarios:1. Automotive Grade: The TLV9002QDGKRQ1 is built to meet the stringent requirements of the automotive industry, making it suitable for use in automotive systems and modules.2. Wide Supply Voltage Range: It operates over a wide supply voltage range of 1.8V to 5.5V, allowing it to work with various power sources commonly found in automotive applications.3. Low Power Consumption: The chip has low power consumption, making it suitable for battery-powered automotive systems where power efficiency is crucial.4. Rail-to-Rail Inputs and Outputs: The TLV9002QDGKRQ1 supports rail-to-rail inputs and outputs, enabling it to handle signals that span the entire supply voltage range. This feature is particularly useful in automotive sensor interfaces and signal conditioning applications.5. High Precision and Low Offset Voltage: It offers high precision and low offset voltage, ensuring accurate amplification and measurement of signals in automotive systems.6. ESD Protection: The chip provides built-in electrostatic discharge (ESD) protection, safeguarding it against damage from static electricity, which is essential in automotive environments.Application scenarios for the TLV9002QDGKRQ1 include:1. Sensor Interfaces: The chip can be used in automotive sensor interfaces, such as temperature sensors, pressure sensors, and position sensors, to amplify and condition the sensor signals for further processing.2. Signal Conditioning: It can be employed in signal conditioning circuits to amplify, filter, and adjust the characteristics of signals before they are fed into other automotive modules or systems.3. Battery Management Systems: The TLV9002QDGKRQ1 can be utilized in battery management systems to monitor and control the voltage levels, current, and temperature of automotive batteries.4. Motor Control: It can be used in motor control applications, such as controlling the speed and direction of automotive motors, including those used in power windows, windshield wipers, and seat adjustments.5. Lighting Systems: The chip can be employed in automotive lighting systems, such as LED drivers, to amplify and control the current flowing through the LEDs.Overall, the TLV9002QDGKRQ1 integrated circuit chip offers automotive-grade performance, low power consumption, and versatile application possibilities, making it suitable for various automotive electronics applications.
TLV9002QDGKRQ1 Relevant information