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TLV313QDCKRQ1

TLV313QDCKRQ1

Manufacturer No:

TLV313QDCKRQ1

Manufacturer:

Texas Instruments

Description:

IC OPAMP GP 1 CIRCUIT SC70-5

Datasheet:

Datasheet

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TLV313QDCKRQ1 Specifications

  • Type
    Parameter
  • -3db Bandwidth
    -
  • Supplier Device Package
    SC-70-5
  • Package / Case
    5-TSSOP, SC-70-5, SOT-353
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Voltage - Supply Span (Max)
    5.5 V
  • Voltage - Supply Span (Min)
    1.8 V
  • Current - Supply
    65µA
  • Voltage - Input Offset
    750 µV
  • Current - Input Bias
    1 pA
  • Gain Bandwidth Product
    1 MHz
  • Slew Rate
    0.5V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    1
  • Amplifier Type
    General Purpose
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    Automotive, AEC-Q100
The TLV313QDCKRQ1 is a low-power, rail-to-rail input and output operational amplifier (op-amp) integrated circuit chip. It offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the TLV313QDCKRQ1 are:Advantages: 1. Low power consumption: The TLV313QDCKRQ1 is designed to operate with low power consumption, making it suitable for battery-powered applications or any scenario where power efficiency is crucial. 2. Rail-to-rail input and output: This op-amp chip supports rail-to-rail input and output voltage ranges, allowing it to handle signals close to the power supply rails. It ensures accurate signal amplification and processing even when the input or output voltage is near the supply voltage limits. 3. Wide supply voltage range: The TLV313QDCKRQ1 can operate with a wide supply voltage range, typically from 1.8V to 5.5V. This flexibility makes it compatible with various power supply configurations and voltage levels. 4. Small package size: The chip is available in a small package, such as the 6-pin SC70 or SOT-23, which makes it suitable for space-constrained applications or designs where miniaturization is essential.Application Scenarios: 1. Portable devices: The low power consumption and small package size of the TLV313QDCKRQ1 make it ideal for portable devices like smartphones, tablets, wearables, or any battery-powered electronics that require signal amplification or conditioning. 2. Sensor interfaces: The rail-to-rail input and output capability of this op-amp chip make it suitable for sensor interface applications. It can accurately amplify and process signals from various sensors, such as temperature sensors, pressure sensors, or light sensors. 3. Audio amplification: The TLV313QDCKRQ1 can be used in audio amplification circuits, especially in low-power audio applications like headphones, earphones, or small speakers. Its rail-to-rail capability ensures accurate amplification of audio signals even at low supply voltages. 4. Industrial automation: The chip's wide supply voltage range and small package size make it suitable for industrial automation applications. It can be used in signal conditioning circuits, motor control systems, or any application where low power consumption and compact size are required.These are just a few examples of the advantages and application scenarios of the TLV313QDCKRQ1 integrated circuit chip. Its low power consumption, rail-to-rail capability, wide supply voltage range, and small package size make it a versatile choice for various electronic designs.
TLV313QDCKRQ1 Relevant information