Home / Instrumentation, OP Amps, Buffer Amps / TLV9002SIDGSR/
TLV9002SIDGSR

TLV9002SIDGSR

Manufacturer No:

TLV9002SIDGSR

Manufacturer:

Texas Instruments

Description:

IC OPAMP GP 2 CIRCUIT 10VSSOP

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

TLV9002SIDGSR Specifications

  • Type
    Parameter
  • -3db Bandwidth
    -
  • Supplier Device Package
    10-VSSOP
  • Package / Case
    10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - Supply Span (Max)
    5.5 V
  • Voltage - Supply Span (Min)
    1.8 V
  • Current - Output / Channel
    40 mA
  • Current - Supply
    60µA
  • Voltage - Input Offset
    400 µV
  • Current - Input Bias
    5 pA
  • Gain Bandwidth Product
    1 MHz
  • Slew Rate
    2V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    2
  • Amplifier Type
    General Purpose
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The TLV9002SIDGSR is a dual operational amplifier integrated circuit chip manufactured by Texas Instruments. It offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the TLV9002SIDGSR are:Advantages: 1. Low power consumption: The TLV9002SIDGSR is designed to operate with low power consumption, making it suitable for battery-powered applications or devices where power efficiency is crucial. 2. Rail-to-rail input and output: This chip supports rail-to-rail input and output voltage ranges, allowing it to handle signals that span the entire supply voltage range. This feature is beneficial in applications where the input or output signals need to be close to the power supply rails. 3. Wide supply voltage range: The TLV9002SIDGSR can operate with a wide supply voltage range, typically from 1.8V to 5.5V. This flexibility makes it compatible with various power supply configurations. 4. Low input offset voltage and low noise: This chip offers low input offset voltage and low noise characteristics, ensuring accurate and high-quality signal amplification.Application Scenarios: 1. Portable devices: The low power consumption and wide supply voltage range of the TLV9002SIDGSR make it suitable for portable devices such as smartphones, tablets, and wearable electronics. It can be used for audio amplification, sensor signal conditioning, or any application requiring low power and high precision. 2. Industrial instrumentation: The TLV9002SIDGSR's rail-to-rail input and output capability, along with its low noise characteristics, make it suitable for industrial instrumentation applications. It can be used for signal conditioning, data acquisition, or control systems where accurate amplification and low noise are essential. 3. Automotive electronics: With its wide supply voltage range and robust performance, the TLV9002SIDGSR can be applied in automotive electronics. It can be used for sensor signal amplification, motor control, or any application requiring reliable and precise amplification in the automotive environment. 4. Audio equipment: The TLV9002SIDGSR's low noise characteristics and rail-to-rail input and output capability make it suitable for audio equipment applications. It can be used for audio amplification, equalization, or any application requiring high-fidelity audio signal processing.These are just a few examples of the advantages and application scenarios of the TLV9002SIDGSR integrated circuit chip. Its versatility, low power consumption, and high precision make it suitable for a wide range of electronic applications.
TLV9002SIDGSR Relevant information