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TLV9002SIRUGR

TLV9002SIRUGR

Manufacturer No:

TLV9002SIRUGR

Manufacturer:

Texas Instruments

Description:

IC OPAMP GP 2 CIRCUIT 10X2QFN

Datasheet:

Datasheet

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TLV9002SIRUGR Specifications

  • Type
    Parameter
  • -3db Bandwidth
    -
  • Supplier Device Package
    10-X2QFN (2x1.5)
  • Package / Case
    10-XFQFN
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - Supply Span (Max)
    5.5 V
  • Voltage - Supply Span (Min)
    1.8 V
  • Current - Output / Channel
    40 mA
  • Current - Supply
    60µA
  • Voltage - Input Offset
    400 µV
  • Current - Input Bias
    5 pA
  • Gain Bandwidth Product
    1 MHz
  • Slew Rate
    2V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    2
  • Amplifier Type
    General Purpose
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The TLV9002SIRUGR is a dual channel operational amplifier (Op-Amp) integrated circuit chip designed by Texas Instruments. It has several advantages and application scenarios, including:1. Low Power Consumption: The TLV9002SIRUGR operates with a low supply current of 760nA per channel, making it suitable for power-constrained applications.2. Rail-to-Rail Input and Output: The chip supports rail-to-rail input and output, allowing it to operate with signals close to either supply rail. This feature increases the dynamic range and flexibility of the chip, making it useful in a variety of applications.3. Wide Temperature Range: The TLV9002SIRUGR is designed to work reliably across a wide temperature range, from -40°C to 125°C. This makes it suitable for applications that require operation under extreme temperature conditions.4. High Precision: The chip offers a low offset voltage and low input bias current, resulting in high precision amplification. It is widely used in applications where accuracy is critical, such as temperature sensors, strain-gauge amplifiers, and voltage/current sensing circuits.5. Battery-Powered Devices: With its low power consumption and rail-to-rail capabilities, the TLV9002SIRUGR is commonly used in battery-powered devices, including portable instrumentation, medical devices, and wearable technology.6. Sensor Conditioning: The TLV9002SIRUGR chip's high precision and low noise characteristics make it suitable for sensor conditioning applications. It can be used to amplify and shape sensor signals before further processing.7. Signal Conditioning: The chip can also be used for general-purpose signal conditioning in various applications, such as filtering, gain adjustment, and buffering.8. Audio Amplification: Due to its low distortion and wide bandwidth, the TLV9002SIRUGR can be utilized in audio amplification applications, including portable audio devices, headphones, and line drivers.Overall, the TLV9002SIRUGR integrated circuit chip offers low power consumption, high precision, and rail-to-rail capabilities, making it versatile for a wide range of applications that require low-power, high-performance amplification.
TLV9002SIRUGR Relevant information