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TLV9001SIDBVR

TLV9001SIDBVR

Manufacturer No:

TLV9001SIDBVR

Manufacturer:

Texas Instruments

Description:

IC CMOS 1 CIRCUIT SOT23-6

Datasheet:

Datasheet

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TLV9001SIDBVR Specifications

  • Type
    Parameter
  • -3db Bandwidth
    -
  • Supplier Device Package
    SOT-23-6
  • Package / Case
    SOT-23-6
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Voltage - Supply Span (Max)
    5.5 V
  • Voltage - Supply Span (Min)
    1.8 V
  • Current - Output / Channel
    40 mA
  • Current - Supply
    60µA
  • Voltage - Input Offset
    400 µV
  • Current - Input Bias
    5 pA
  • Gain Bandwidth Product
    1 MHz
  • Slew Rate
    2V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    1
  • Amplifier Type
    CMOS
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The TLV9001SIDBVR is a low-power, rail-to-rail input and output operational amplifier (op-amp) integrated circuit chip. Some of its advantages and application scenarios include:1. Low power consumption: The TLV9001SIDBVR is designed to operate with very low power consumption, making it suitable for battery-powered applications or any application where power efficiency is crucial.2. Rail-to-rail input and output: This op-amp chip supports rail-to-rail input and output voltage ranges, allowing it to handle signals that span the entire supply voltage range. This feature is particularly useful in applications where the input or output signals need to be close to the power supply rails.3. Wide supply voltage range: The TLV9001SIDBVR can operate with a wide supply voltage range, typically from 1.8V to 5.5V. This flexibility makes it compatible with a variety of power supply configurations and voltage levels.4. High precision and accuracy: This op-amp chip offers high precision and accuracy in amplifying and processing signals, making it suitable for applications that require precise measurements or signal conditioning.5. Small package size: The TLV9001SIDBVR is available in a small package size, such as the SOT-23-5 package, which makes it suitable for space-constrained applications or designs where miniaturization is important.Application scenarios for the TLV9001SIDBVR include:1. Portable devices: Due to its low power consumption and small package size, this op-amp chip is commonly used in portable devices such as smartphones, tablets, portable audio players, and wearable devices.2. Sensor interfaces: The TLV9001SIDBVR's high precision and accuracy make it suitable for sensor interface applications, where it can amplify and condition signals from various sensors like temperature sensors, pressure sensors, or light sensors.3. Battery-powered systems: The low power consumption of this op-amp chip makes it ideal for battery-powered systems, such as wireless sensor networks, remote monitoring systems, or IoT devices, where power efficiency is critical for extended battery life.4. Signal conditioning: The rail-to-rail input and output capability of the TLV9001SIDBVR make it suitable for signal conditioning applications, where it can amplify, filter, or adjust the level of signals before further processing or transmission.5. Industrial and automotive applications: The TLV9001SIDBVR's wide supply voltage range and robustness make it suitable for industrial and automotive applications, such as motor control, power management, or control systems, where it can operate reliably in harsh environments.
TLV9001SIDBVR Relevant information