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TLV9001UIDBVR

TLV9001UIDBVR

Manufacturer No:

TLV9001UIDBVR

Manufacturer:

Texas Instruments

Description:

IC CMOS 1 CIRCUIT SOT23-5

Datasheet:

Datasheet

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TLV9001UIDBVR Specifications

  • Type
    Parameter
  • -3db Bandwidth
    -
  • Supplier Device Package
    SOT-23-5
  • Package / Case
    SC-74A, SOT-753
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Voltage - Supply Span (Max)
    5.5 V
  • Voltage - Supply Span (Min)
    1.8 V
  • Current - Output / Channel
    40 mA
  • Current - Supply
    60µA
  • Voltage - Input Offset
    400 µV
  • Current - Input Bias
    5 pA
  • Gain Bandwidth Product
    1 MHz
  • Slew Rate
    2V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    1
  • Amplifier Type
    CMOS
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The TLV9001UIDBVR is a low-power, rail-to-rail input and output operational amplifier (op-amp) integrated circuit chip. Some of its advantages and application scenarios include:1. Low power consumption: The TLV9001UIDBVR is designed to operate with very low power consumption, making it suitable for battery-powered applications or any other power-constrained systems.2. Rail-to-rail input and output: This op-amp chip supports rail-to-rail input and output voltage ranges, allowing it to handle signals that span the entire supply voltage range. This feature is particularly useful in applications where the input or output signals need to be close to the power supply rails.3. Wide supply voltage range: The TLV9001UIDBVR can operate with a wide supply voltage range, typically from 1.8V to 5.5V. This flexibility makes it compatible with a variety of power supply configurations and voltage levels.4. High precision and accuracy: This op-amp chip offers high precision and accuracy in amplifying and processing signals, making it suitable for applications that require precise measurements or signal conditioning.5. Small form factor: The TLV9001UIDBVR is available in a small SOT-23 package, which makes it suitable for space-constrained applications or designs where miniaturization is a requirement.6. General-purpose applications: The TLV9001UIDBVR can be used in a wide range of general-purpose applications, such as sensor interfaces, data acquisition systems, portable devices, audio amplification, and low-power signal conditioning.7. Low noise and distortion: This op-amp chip has low noise and distortion characteristics, making it suitable for applications that require high-fidelity amplification or signal processing.8. Automotive applications: The TLV9001UIDBVR is qualified for automotive applications, making it suitable for use in automotive electronics, such as infotainment systems, powertrain control modules, and sensor interfaces.Overall, the TLV9001UIDBVR integrated circuit chip offers low power consumption, rail-to-rail operation, wide supply voltage range, high precision, and small form factor, making it suitable for a variety of applications in different industries.
TLV9001UIDBVR Relevant information