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TLV9001IDCKR

TLV9001IDCKR

Manufacturer No:

TLV9001IDCKR

Manufacturer:

Texas Instruments

Description:

IC CMOS 1 CIRCUIT SC70-5

Datasheet:

Datasheet

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TLV9001IDCKR Specifications

  • Type
    Parameter
  • -3db Bandwidth
    -
  • Supplier Device Package
    SC-70-5
  • Package / Case
    5-TSSOP, SC-70-5, SOT-353
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - Supply Span (Max)
    5.5 V
  • Voltage - Supply Span (Min)
    1.8 V
  • Current - Output / Channel
    40 mA
  • Current - Supply
    60µA
  • Voltage - Input Offset
    400 µV
  • Current - Input Bias
    5 pA
  • Gain Bandwidth Product
    1 MHz
  • Slew Rate
    2V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    1
  • Amplifier Type
    CMOS
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The TLV9001IDCKR integrated circuit chips offer several advantages and find use in various application scenarios. Here are some of the advantages and applications of TLV9001IDCKR chips:Advantages: 1. Low Power Consumption: TLV9001IDCKR chips are designed to operate at very low power, making them suitable for battery-powered applications. 2. Rail-to-Rail Input and Output: These chips offer rail-to-rail input and output capabilities, allowing them to operate with signals that span the full range between the supply rails. This feature is beneficial in applications where the input or output signals reach close to the supply rail levels. 3. High Speed: TLV9001IDCKR chips offer high-speed performance, enabling them to process signals quickly and accurately. 4. Low Offset Voltage and Input Bias Current: These chips have low offset voltage and input bias current, ensuring accurate and precise measurements. 5. Wide Supply Voltage Range: TLV9001IDCKR chips operate over a wide supply voltage range, enabling flexibility in design and compatibility with different power sources. 6. Small Form Factor: The chips come in a small package, which makes them suitable for applications where space is limited.Application Scenarios: 1. Portable Devices: The low power consumption and small form factor of TLV9001IDCKR chips make them ideal for use in portable devices like smartphones, tablets, wearables, and portable medical devices. 2. Sensor Interface: TLV9001IDCKR chips can be used in various sensor applications, such as temperature sensors, pressure sensors, gas sensors, and proximity sensors, where they provide accurate, low-power signal conditioning and amplification. 3. Battery Management Systems: These chips can be used in battery management systems for monitoring and controlling battery voltage levels, providing accurate measurements using low-power consumption. 4. Industrial Automation: TLV9001IDCKR chips find applications in industrial automation, such as motor control, process control, and robotics, where their high-speed performance, low offset voltage, and rail-to-rail capabilities are essential. 5. Medical Devices: TLV9001IDCKR chips can be used in medical devices like blood glucose meters, heart rate monitors, and medical imaging equipment, where accurate signal conditioning and low-power operation are vital. 6. Automotive Electronics: These chips can be utilized in automotive electronics, including vehicle infotainment systems, in-vehicle networks, and electronic control units, providing accurate signal conditioning and low-power operation.Overall, the TLV9001IDCKR integrated circuit chips offer advantages like low power consumption, rail-to-rail operation, high speed, and small form factor, making them versatile for various applications.
TLV9001IDCKR Relevant information